NTHD5904N_05 Datasheet, PDF (1/6 Pages) ON Semiconductor – Power MOSFET 20 V, 4.5 A, Dual N−Channel, ChipFET

NTHD5904N
Power MOSFET
20 V, 4.5 A, Dual N−Channel, ChipFETt
Features
• Low R_DS(on) and Fast Switching Speed
• Leadless ChipFET Package has 40% Smaller Footprint than TSOP−6.
Ideal Device for Applications Where Board Space is at a Premium.
• ChipFET Package Exhibits Excellent Thermal Capabilities. Ideal for
Applications Where Heat Transfer is Required.
• Pb−Free Packages are Available
Applications
• DC−DC Buck or Boost Converters
• Low Side Switching
• Optimized for Battery and Low Side Switching Applications in
Computing and Portable Equipment
http://onsemi.com
V_(BR)DSS
20 V
R_DS(on) TYP
40 mW @ 4.5 V
55 mW @ 2.5 V
I_D MAX
4.5 A
N−Channel MOSFET
D₁, D₂
MAXIMUM RATINGS (T_J = 25°C unless otherwise noted)
Parameter
Symbol Value Unit
Drain−to−Source Voltage
V_DSS
20
V
Gate−to−Source Voltage
V_GS
±8.0
V
Continuous Drain
Current (Note 1)
Steady ^TA^=25°C
I_D
State _TA=85°C
3.3
A
2.4
t ≤ 5 s T_A=25°C
4.5
Power Dissipation
(Note 1)
Steady
State
T_A=25°C
P_D
1.13
W
Continuous Drain
Current (Note 2)
Power Dissipation
(Note 2)
T_A=25°C
I_D
Steady T_A=85°C
State
T_A=25°C
P_D
2.5
A
1.8
0.64
W
Pulsed Drain Current
t_p=10 ms
I_DM
10
A
Operating Junction and Storage Temperature T_J,
−55 to °C
T_STG
150
Source Current (Body Diode)
I_S
2.6
A
Lead Temperature for Soldering Purposes
(1/8” from case for 10 s)
T_L
260
°C
THERMAL RESISTANCE RATINGS
Parameter
Symbol Max Unit
Junction−to−Ambient – Steady State (Note 1) R_qJA
110 °C/W
Junction−to−Ambient – t ≤ 5 s (Note 1)
R_qJA
60
Junction−to−Ambient – Steady State (Note 2) R_qJA
195
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. Surface Mounted on FR4 Board using 1 in sq pad size (Cu area = 1.127 in sq
[1 oz] including traces).
2. Surface Mounted on FR4 Board using the minimum recommended pad size
(Cu area = 0.214 in sq).
3. ESD Rating Information: Human Body Model (HBM) Class 0.
G₁, G₂
S₁, S₂
ChipFET
CASE 1206A
STYLE 2
PIN
CONNECTIONS
MARKING
DIAGRAM
D₁ 8
1 S₁
1
8
D₁ 7
2 G₁ 2
7
D₂ 6
3 S₂ 3
6
D₂ 5
4 G₂ 4
5
(Top View)
D3 = Specific Device Code
M = Month Code
G = Pb−Free Package
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
© Semiconductor Components Industries, LLC, 2005
1
November, 2005 − Rev. 2
Publication Order Number:
NTHD5904N/D