NTHD4508N Datasheet, PDF (1/6 Pages) ON Semiconductor – Power MOSFET 20 V, 4.1 A, Dual N−Channel ChipFET

NTHD4508N
Power MOSFET
20 V, 4.1 A, Dual N−Channel ChipFETt
Features
• Low R_DS(on) and Fast Switching Speed
• Leadless ChipFET Package has 40% Smaller Footprint than TSOP−6
• Excellent Thermal Capabilities Where Heat Transfer is Required
• Pb−Free Package is Available
Applications
• DC−DC Buck/Boost Converters
• Battery and Low Side Switching in Portable Equipment Such as MP3
Players, Cell Phones, DSCs and PDAs
• Level Shifting
http://onsemi.com
V_(BR)DSS
20 V
R_DS(on) TYP
60 mW @ 4.5 V
80 mW @ 2.5 V
I_D MAX
4.1 A
D₁, D₂
MAXIMUM RATINGS (T_J = 25°C unless otherwise noted)
Parameter
Symbol Value Unit
Drain−to−Source Voltage
Gate−to−Source Voltage
Continuous Drain
Current
Steady
State
T_J = 25 °C
T_J = 85 °C
t v 5 s T_J = 25 °C
Power Dissipation
Steady
State
T_J = 25 °C
T_J = 85 °C
t v 5 s T_J = 25 °C
Pulsed Drain Current
t_p = 10 µs
Operating Junction and Storage Temperature
Lead Temperature for Soldering Purposes
(1/8” from case for 10 s)
V_DSS
V_GS
I_D
P_D
I_DM
T_J,
T_STG
T_L
20
V
±12
V
3.0
A
2.2
4.1
1.13 W
0.59
2.1
12
A
−55 to °C
150
260
°C
THERMAL RESISTANCE RATINGS
Parameter
Symbol
Max
Unit
Junction−to−Ambient – Steady State
(Note 1)
R_θJA
110
°C/W
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. Surface Mounted on FR4 Board using 1 in sq pad size (Cu area = 1.27 in sq
[1 oz] including traces).
G₁, G₂
S₁, S₂
N−Channel MOSFET
ChipFET
CASE 1206A
STYLE 2
PIN
CONNECTIONS
MARKING
DIAGRAM
D₁ 8
1 S₁
1
8
D₁ 7
2 G₁ 2
7
D₂ 6
3 S₂
3
6
D₂ 5
4 G₂ 4
5
C8 = Specific Device Code
M = Month Code
ORDERING INFORMATION
Device
Package
Shipping^†
NTHD4508NT1 ChipFET 3000/Tape & Reel
NTHD4508NT1G
ChipFET
(Pb−Free)
3000/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2004
1
October, 2004 − Rev. 3
Publication Order Number:
NTHD4508N/D