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NTHD4401P_05 Datasheet, PDF (1/6 Pages) ON Semiconductor – Power MOSFET -20 V, -3.0 A, Dual P-Channel, ChipFET | |||
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NTHD4401P
Power MOSFET
â20 V, â3.0 A, Dual PâChannel, ChipFETt
Features
⢠Low RDS(on) and Fast Switching Speed in a ChipFET Package
⢠Leadless ChipFET Package 40% Smaller Footprint than TSOPâ6
⢠ChipFET Package with Excellent Thermal Capabilities where Heat
Transfer is Required
⢠PbâFree Package is Available
Applications
⢠Charge Control in Battery Chargers
⢠Optimized for Battery and Load Management Applications in
Portable Equipment
⢠MP3 Players, Cell Phones, Digital Cameras, PDAs
⢠Buck and Boost DCâDC Converters
http://onsemi.com
V(BR)DSS
â20 V
RDS(on) TYP
130 mW @ â4.5 V
200 mW @ â2.5 V
ID MAX
â3.0 A
S1
S2
G1
G2
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Rating
Symbol Value Unit
DrainâtoâSource Voltage
VDSS
â20
V
GateâtoâSource Voltage
VGS
"12
V
Continuous Drain
Current (Note 1)
Steady TA = 25°C
ID
State TA = 85°C
â2.1
A
â1.5
t v 5 s TA = 25°C
â3.0
Power Dissipation
(Note 1)
Steady TA = 25°C
PD
State TA = 85°C
1.1
W
0.6
t v 5 s TA = 25°C
2.1
Pulsed Drain Current
tp = 10 ms
IDM
â9.0
A
Operating Junction and Storage Temperature TJ, Tstg â55 to °C
150
Source Current (Body Diode)
Lead Temperature for Soldering Purposes
(1/8â³ from case for 10 s)
IS
â2.5
A
TL
260
°C
THERMAL RESISTANCE RATINGS
Rating
Symbol Value Unit
JunctionâtoâAmbient â Steady State (Note 1) RqJA
110 °C/W
JunctionâtoâAmbient â t v 5 s
60
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. Surface Mounted on FR4 Board using 1 in sq pad size (Cu area = 1.27 in sq
[1 oz] including traces).
© Semiconductor Components Industries, LLC, 2005
1
November, 2005 â Rev. 4
D1
PâChannel MOSFET
D2
PâChannel MOSFET
ChipFET
CASE 1206A
STYLE 2
PIN
CONNECTIONS
MARKING
DIAGRAM
D1 8
1 S1
1
8
D1 7
2 G1 2
7
D2 6
3 S2
3
6
D2 5
4 G2 4
5
C4 = Specific Device Code
M = Month Code
G = PbâFree Package
ORDERING INFORMATION
Device
Package
Shippingâ
NTHD4401PT1 ChipFET 3000/Tape & Reel
NTHD4401PT1G ChipFET 3000/Tape & Reel
(PbâFree)
â For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Publication Order Number:
NTHD4401P/D
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