NTHD4401P Datasheet, PDF (1/8 Pages) ON Semiconductor – Power MOSFET −20 V, −3.0 A, Dual P−Channel, ChipFET

NTHD4401P
Power MOSFET
−20 V, −3.0 A, Dual P−Channel, ChipFETt
Features
• Low R_DS(on) and Fast Switching Speed in a ChipFET Package
• Leadless ChipFET Package 40% Smaller Footprint than TSOP−6
• ChipFET Package with Excellent Thermal Capabilities where Heat
Transfer is Required
• Pb−Free Package is Available
Applications
• Charge Control in Battery Chargers
• Optimized for Battery and Load Management Applications in
Portable Equipment
• MP3 Players, Cell Phones, Digital Cameras, PDAs
• Buck and Boost DC−DC Converters
MAXIMUM RATINGS (T_J = 25°C unless otherwise noted)
Rating
Symbol Value Unit
Drain−to−Source Voltage
V_DSS
−20
V
Gate−to−Source Voltage
V_GS
"12
V
Continuous Drain
Current (Note 1)
Steady ^{TA = 25°C}
I_D
State _{TA = 85°C}
−2.1
A
−1.5
t v 5 s T_A = 25°C
−3.0
Power Dissipation
(Note 1)
Steady ^{TA = 25°C}
P_D
State _{TA = 85°C}
1.1
W
0.6
t v 5 s T_A = 25°C
2.1
Pulsed Drain Current
tp = 10 ms
I_DM
−9.0
A
Operating Junction and Storage Temperature
T_J, T_stg −55 to
°C
150
Source Current (Body Diode)
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
I_S
−2.5
A
T_L
260
°C
THERMAL RESISTANCE RATINGS
Rating
Junction−to−Ambient − Steady State (Note 1)
Junction−to−Ambient − t v 5 s
Symbol
R_qJA
Value
110
60
Unit
°C/W
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. Surface Mounted on FR4 Board using 1 in sq pad size (Cu area = 1.27 in sq
[1 oz] including traces).
http://onsemi.com
V_(BR)DSS
−20 V
R_DS(on) TYP
130 mW @ −4.5 V
200 mW @ −2.5 V
I_D MAX
−3.0 A
S₁
S₂
G₁
G₂
D₁
P−Channel MOSFET
D₂
P−Channel MOSFET
ChipFET
CASE 1206A
STYLE 2
PIN
CONNECTIONS
MARKING
DIAGRAM
D₁ 8
1 S₁
1
8
D₁ 7
2 G₁ 2
7
D₂ 6
3 S₂
3
6
D₂ 5
4 G₂ 4
5
C4 = Specific Device Code
M = Month Code
ORDERING INFORMATION
Device
Package
Shipping^†
NTHD4401PT1 ChipFET 3000/Tape & Reel
NTHD4401PT1G ChipFET 3000/Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2004
1
October, 2004 − Rev. 3
Publication Order Number:
NTHD4401P/D