NTHD3100C Datasheet, PDF (1/8 Pages) ON Semiconductor – Power MOSFET 20 V, +3.9 A /−4.4 A, Complementary ChipFET

NTHD3100C
AND PIN A
Power MOSFET
20 V, +3.9 A /−4.4 A,
Complementary ChipFETt
Features
• Complementary N−Channel and P−Channel MOSFET
• Small Size, 40% Smaller than TSOP−6 Package
• Leadless SMD Package Provides Great Thermal Characteristics
• Trench P−Channel for Low On Resistance
• Low Gate Charge N−Channel for Test Switching
• Pb−Free Packages are Available
Applications
• DC−DC Conversion Circuits
• Load Switch Applications Requiring Level Shift
• Drive Small Brushless DC Motors
• Ideal for Power Management Applications in Portable, Battery
Powered Products
MAXIMUM RATINGS (T_J = 25°C unless otherwise noted)
Parameter
Symbol Value Unit
Drain−to−Source Voltage
Gate−to−Source Voltage
N−Ch
P−Ch
V_DSS
20
V
V_GS
"12
V
"8.0
N−Channel
Continuous Drain
Current (Note 1)
P−Channel
Continuous Drain
Current (Note 1)
Power Dissipation
(Note 1)
Steady T_A = 25°C
I_D
State
T_A = 85°C
t ≤ 10 s T_A = 25°C
Steady T_A = 25°C
I_D
State
T_A = 85°C
t ≤ 10 s T_A = 25°C
Steady
P_D
State _{TA = 25°C}
t ≤5 s
2.9
A
2.1
3.9
−3.2 A
−2.3
−4.4
1.1
W
3.1
Pulsed Drain Current
(Note 1)
N−Ch t = 10 ms
I_DM
P−Ch t = 10 ms
12
A
−13
Operating Junction and Storage Temperature
T_J, −55 to °C
T_STG
150
Source Current (Body Diode)
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 seconds)
I_S
2.5
A
T_L
260 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface−mounted on FR4 board using 1 in sq pad size (Cu area = 1.127 in sq
[1 oz] including traces).
http://onsemi.com
V_(BR)DSS
N−Channel
20 V
P−Channel
−20 V
R_DS(on) Typ
58 mW @ 4.5 V
77 mW @ 2.5 V
64 mW @ −4.5 V
85 mW @ −2.5 V
I_D MAX
3.9 A
−4.4 A
D1
S2
G1
G2
S1
N−Channel MOSFET
D2
P−Channel MOSFET
8
1
ChipFET
CASE 1206A
STYLE 2
PIN
CONNECTIONS
MARKING
DIAGRAM
D₁ 8
1 S₁ 1
8
D₁ 7
2 G₁ 2
7
D₂ 6
3 S₂ 3
6
D₂ 5
4 G₂ 4
5
C9
= Specific Device Code
M
= Month Code
G
= Pb−Free Package
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 7 of this data sheet.
© Semiconductor Components Industries, LLC, 2006
1
March, 2006 − Rev. 3
Publication Order Number:
NTHD3100C/D