NTGS4141N_14 Datasheet, PDF (1/6 Pages) ON Semiconductor – Power MOSFET

NTGS4141N, NVGS4141N
Power MOSFET
30 V, 7.0 A, Single N−Channel, TSOP−6
Features
• Low R_DS(on)
• Low Gate Charge
• NV Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
• Pb−Free Package is Available
Applications
• Load Switch
• Notebook PC
• Desktop PC
MAXIMUM RATINGS (T_J = 25°C unless otherwise noted)
Rating
Symbol Value Unit
Drain−to−Source Voltage
V_DSS
30
V
Gate−to−Source Voltage
V_GS
±20
V
Continuous Drain
Current (Note 1)
Steady T_A = 25°C
I_D
State _{TA = 85°C}
5.0
A
3.6
t ≤ 10 s T_A = 25°C
7.0
Power Dissipation
(Note 1)
Steady T_A = 25°C P_D
State
1.0
W
t ≤ 10 s
2.0
Continuous Drain
Current (Note 2)
Power Dissipation
(Note 2)
Steady T_A = 25°C
I_D
State _{TA = 85°C}
T_A = 25°C P_D
3.5
A
2.5
0.5
W
Pulsed Drain Current
t_p = 10 ms, V_GS=10V I_DM
45
A
Pulsed Drain Current
t_p = 30 ms, V_GS=5V
I_D
30
A
Operating Junction and Storage Temperature
T_J,
−55 to °C
T_STG
150
Source Current (Body Diode)
I_S
2.0
A
Single Pulse Drain−to−Source Avalanche Energy
(V_DD = 30 V, I_L = 10.4 A, V_GS = 10 V,
L = 1.0 mH, R_G = 25 W)
EAS
54
mJ
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
T_L
260
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
THERMAL RESISTANCE RATINGS
Rating
Symbol Max Unit
Junction−to−Ambient – Steady State (Note 1)
R_θJA
125 °C/W
Junction−to−Ambient – t ≤ 10 s (Note 1)
R_θJA
62.5
Junction−to−Ambient – Steady State (Note 2)
R_θJA
248
1. Surface−mounted on FR4 board using 1 inch sq pad size
(Cu area = 1.127 in sq [1 oz] including traces).
2. Surface−mounted on FR4 board using the minimum recommended pad size
(Cu area = 0.0773 in sq).
http://onsemi.com
V_(BR)DSS
30 V
R_DS(on) TYP
21.5 mW @ 10 V
30 mW @ 4.5 V
I_D MAX
7.0 A
N−Channel
Drain 1 2 5 6
Gate 3
Source 4
TSOP−6
CASE 318G
1
STYLE 1
MARKING
DIAGRAM
XX MG
G
XX
= Device Code
M
= Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
PIN ASSIGNMENT
Drain Drain Source
654
1 23
Drain Drain Gate
ORDERING INFORMATION
See detailed ordering and shipping information ion page 5 of
this data sheet.
© Semiconductor Components Industries, LLC, 2014
1
August, 2014 − Rev. 6
Publication Order Number:
NTGS4141N/D