NTGS3443T1 Datasheet, PDF (1/6 Pages) ON Semiconductor – Power MOSFET 2 Amps, 20 Volts P−Channel TSOP−6

NTGS3443T1
Power MOSFET
2 Amps, 20 Volts
P−Channel TSOP−6
Features
• Ultra Low R_DS(on)
• Higher Efficiency Extending Battery Life
• Miniature TSOP6 Surface Mount Package
• Pb−Free Package May be Available. The G−Suffix Denotes a
Pb−Free Lead Finish
Applications
• Power Management in Portable and Battery−Powered Products, i.e.:
Cellular and Cordless Telephones, and PCMCIA Cards
MAXIMUM RATINGS (T_J = 25°C unless otherwise noted)
Rating
Symbol Value Unit
Drain−to−Source Voltage
Gate−to−Source Voltage − Continuous
Thermal Resistance
Junction−to−Ambient (Note 1)
Total Power Dissipation @ T_A = 25°C
Drain Current − Continuous @ T_A = 25°C
− Pulsed Drain Current (T_p t 10 mS)
Thermal Resistance
Junction−to−Ambient (Note 2)
Total Power Dissipation @ T_A = 25°C
Drain Current − Continuous @ T_A = 25°C
− Pulsed Drain Current (T_p t 10 mS)
Thermal Resistance
Junction−to−Ambient (Note 3)
Total Power Dissipation @ T_A = 25°C
Drain Current − Continuous @ T_A = 25°C
− Pulsed Drain Current (T_p t 10 mS)
Operating and Storage Temperature Range
V_DSS
V_GS
R_qJA
P_d
I_D
I_DM
R_qJA
P_d
I_D
I_DM
R_qJA
P_d
I_D
I_DM
T_J, T_stg
−20
"12
Volts
Volts
244
0.5
−2.2
−10
°C/W
Watts
Amps
Amps
128
1.0
−3.1
−14
°C/W
Watts
Amps
Amps
62.5
2.0
−4.4
−20
−55 to
150
°C/W
Watts
Amps
Amps
°C
Maximum Lead Temperature for Soldering
T_L
260
°C
Purposes for 10 Seconds
1. Minimum FR−4 or G−10PCB, operating to steady state.
2. Mounted onto a 2 in square FR−4 board (1″ sq. 2 oz. cu. 0.06″ thick single
sided), operating to steady state.
3. Mounted onto a 2 in square FR−4 board (1″ sq. 2 oz. cu. 0.06″ thick single
sided), t t 5.0 seconds.
http://onsemi.com
2 AMPERES
20 VOLTS
R_DS(on) = 65 mW
P−Channel
1256
3
4
TSOP−6
CASE 318G
Style 1
MARKING
DIAGRAM
443
W
443 = Device Code
W
= Work Week
PIN ASSIGNMENT
Drain Drain Source
6 54
1 23
Drain Drain Gate
ORDERING INFORMATION
Device
Package
Shipping^†
NTGS3443T1
TSOP−6 3000 Tape & Reel
NTGS3443T1G TSOP−6 3000 Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2003
1
December, 2003 − Rev. 2
Publication Order Number:
NTGS3443T1/D