NTGS3433T1_06 Datasheet, PDF (1/5 Pages) ON Semiconductor – MOSFET -3.3 Amps, -12 Volts

NTGS3433T1
MOSFET
−3.3 Amps, −12 Volts
P−Channel TSOP−6
Features
• Ultra Low R_DS(on)
• Higher Efficiency Extending Battery Life
• Miniature TSOP−6 Surface Mount Package
• Pb−Free Package is Available
Applications
• Power Management in Portable and Battery−Powered Products,
i.e.: Cellular and Cordless Telephones, and PCMCIA Cards
MAXIMUM RATINGS (T_J = 25°C unless otherwise noted.)
Rating
Symbol Value Unit
Drain−to−Source Voltage
Gate−to−Source Voltage − Continuous
Thermal Resistance
Junction−to−Ambient (Note 1)
Total Power Dissipation @ T_A = 25°C
Drain Current
− Continuous @ T_A = 25°C
− Pulsed Drain Current (T_p t 10 mS)
Maximum Operating Power Dissipation
Maximum Operating Drain Current
Thermal Resistance
Junction−to−Ambient (Note 2)
Total Power Dissipation @ T_A = 25°C
Drain Current
− Continuous @ T_A = 25°C
− Pulsed Drain Current (T_p t 10 mS)
Maximum Operating Power Dissipation
Maximum Operating Drain Current
Operating and Storage Temperature Range
V_DSS
V_GS
R_qJA
P_d
I_D
I_DM
P_d
I_D
−12
"8.0
Volts
Volts
62.5
2.0
−3.3
−20
1.0
−2.35
°C/W
Watts
Amps
Amps
Watts
Amps
R_qJA
P_d
I_D
I_DM
P_d
I_D
128
1.0
−2.35
−14
0.5
−1.65
°C/W
Watts
Amps
Amps
Watts
Amps
T_J, T_stg − 55 to °C
150
Maximum Lead Temperature for Soldering
Purposes for 10 Seconds
T_L
260
°C
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. Mounted onto a 2″ square FR−4 board (1 in sq, 2 oz. Cu 0.06″ thick single
sided), t t 5.0 seconds.
2. Mounted onto a 2″ square FR−4 board (1 in sq, 2 oz. Cu 0.06″ thick single
sided), operating to steady state.
http://onsemi.com
V_(BR)DSS
−12 V
R_DS(on) TYP
75 mW @ −4.5 V
I_D Max
−3.3 A
P−Channel
1256
DRAIN
3
GATE
1
TSOP−6
CASE 318G
STYLE 1
4
SOURCE
MARKING DIAGRAM &
PIN ASSIGNMENT
Drain Drain Source
654
433 M G
G
123
Drain Drain Gate
433 = Specific Device Code
M
= Date Code*
G
= Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation may vary depending
upon manufacturing location.
ORDERING INFORMATION
Device
Package
Shipping^†
NTGS3433T1
NTGS3433T1G
TSOP−6 3000 Tape & Reel
TSOP−6 _{3000 Tape & Reel}
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2006
1
February, 2006 − Rev. 2
Publication Order Number:
NTGS3433T1/D