NTGS3130N Datasheet, PDF (1/5 Pages) ON Semiconductor – Power MOSFET 20 V, 5.6 A Single N-Channel, TSOP-6

NTGS3130N
Power MOSFET
20 V, 5.6 A Single
N-Channel, TSOP-6
Features
•ăLeading Edge Trench Technology for Low On Resistance
•ăLow Gate Charge for Fast Switching
•ăSmall Size (3 x 2.75 mm) TSOP-6 Package
•ăThis is a Pb-Free Device
Applications
•ăDC-DC Converters
•ăLithium Ion Battery Applications
•ăLoad/Power Switching
MAXIMUM RATINGS (T_J = 25°C unless otherwise noted)
Rating
Symbol Value Unit
Drain-to-Source Voltage
V_DSS
20
V
Gate-to-Source Voltage
V_GS
±8
V
Steady ^{TA = 25°C}
Continuous Drain Current
(Note 1)
State
T_A = 85°C
I_D
t ≤ 10 s T_A = 25°C
5.6
4.1
A
6.2
Power Dissipation
(Note 1)
Steady
State _{TA = 25°C}
P_D
t ≤ 10 s
1.1
W
1.4
Continuous Drain Current
T_A = 25°C
(Note 2)
Steady T_A = 85°C
I_D
Power Dissipation
(Note 2)
State
T_A = 25°C P_D
4.2
A
3.0
0.6 W
Pulsed Drain Current
t_P ≤ 10 s
Operating and Storage Temperature Range
I_DM
19
A
T_J, T_stg
-ā55 to
150
°C
Source Current (Body Diode)
Lead Temperature for Soldering Purposes
(1/8” from case for 10 s)
I_S
1.0
A
T_L
260 °C
THERMAL RESISTANCE RATINGS
Parameter
Symbol Max Unit
Junction-to-Ambient - Steady State (Note 1)
110
Junction-to-Ambient - t ≤ 10 s (Note 1)
Junction-to-Ambient - Steady State (Note 2)
R_qJA
90 °C/W
200
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface-mounted on FR4 board using 1 in sq pad size
(Cu area = 1.127 in sq [1 oz] including traces)
2. Surface-mounted on FR4 board using the minimum recommended pad size
http://onsemi.com
V_(BR)DSS
20 V
R_DS(on) mAX
24 mW @ 4.5 V
32 mW @ 2.5 V
N-Channel
Drain 1 2 5 6
I_D Max
5.6 A
4.9 A
Gate 3
Source 4
MARKING DIAGRAM &
PIN ASSIGNMENT
1
TSOP-6
CASE 318G
STYLE 1
Drain Drain Source
654
S9 MĂG
G
123
Drain Drain Gate
S9
= Specific Device Code
M
= Date Code*
G
= Pb-Free Package
(Note: Microdot may be in either location)
*Date Code orientation may vary depending
upon manufacturing location.
ORDERING INFORMATION
Device
Package
Shipping^†
NTGS3130NT1G TSOP-6 3000/Tape & Reel
(Pb-Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
©Ă Semiconductor Components Industries, LLC, 2007
1
May, 2007 - Rev. 0
Publication Order Number:
NTGS3130N/D