NTGS1135P Datasheet, PDF (1/5 Pages) ON Semiconductor – Power MOSFET −8 V, −5.8 A, Single P−Channel, TSOP−6

NTGS1135P
Power MOSFET
−8 V, −5.8 A, Single P−Channel, TSOP−6
Features
• Ultra Low R_DS(on)
• 1.2 V R_DS(on) Rating
• This is a Pb−Free Device
Applications
• Load Switch
• Battery Management
MAXIMUM RATINGS (T_J = 25°C unless otherwise stated)
Parameter
Symbol Value Unit
Drain−to−Source Voltage
V_DSS
−8.0
V
Gate−to−Source Voltage
V_GS
$6.0
V
Continuous Drain
Current (Note 1)
Steady ^{TA = 25°C}
I_D
State _{TA = 85°C}
−4.6
−3.3
A
t v 5 s T_A = 25°C
−5.8
Power Dissipation
(Note 1)
Steady
P_D
State _{TA = 25°C}
tv5s
0.97
W
1.6
Pulsed Drain Current t_p = 10 ms
Operating Junction and Storage Temperature
I_DM
−9.2
A
T_J,
−55 to °C
T_STG
150
Source Current (Body Diode)
Lead Temperature for Soldering Purposes
(1/8” from case for 10 s)
I_S
−1.0
A
T_L
260
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface−mounted on FR4 board using 1 in sq pad size (Cu area = 1 in sq
[2 oz] including traces)
2. Surface−mounted on FR4 board using the minimum recommended pad size.
(Cu area = 0.0751 in sq)
THERMAL RESISTANCE MAXIMUM RATINGS
Parameter
Symbol Value Unit
Junction−to−Ambient – Steady State (Note 1)
Junction−to−Ambient – t = 5 s (Note 1)
Junction−to−Ambient – Steady State (Note 2)
R_qJA
R_qJA
R_qJA
128
78 °C/W
188
http://onsemi.com
V_(BR)DSS
−8 V
R_DS(ON) MAX
31 mW @ −4.5 V
38 mW @ −2.5 V
57 mW @ −1.8 V
300 mW @ −1.2 V
I_D MAX
−4.6 A
P−Channel
1256
3
4
MARKING
DIAGRAM
1
TSOP−6
CASE 318G
STYLE 1
AA MG
G
1
AA
= Device Code
M
= Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
PIN ASSIGNMENT
Drain Drain Source
6 54
1 23
Drain Drain Gate
ORDERING INFORMATION
Device
Package
Shipping^†
NTGS1135PT1G TSOP−6 3000 / Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2008
1
October, 2008 − Rev. 0
Publication Order Number:
NTGS1135P/D