NTGD3148N Datasheet, PDF (1/5 Pages) ON Semiconductor – Power MOSFET 20 V, 3.5 A, Dual N-Channel, TSOP-6

NTGD3148N
Power MOSFET
20 V, 3.5 A, Dual N-Channel, TSOP-6
Features
•ăLow Threshold Levels, VGS(th) < 1.5 V
•ăLow Gate Charge (3.8 nC)
•ăLeading Edge Trench Technology of Low R_DS(on)
•ăHigh Power and Current Handling Capability
•ăThis is a Pb-Free Device
Applications
•ăDC-DC Converters (Buck and Boost Circuits)
•ăLow Side Load Switch
•ăOptimized for Battery and Load Management Applications in
Portable Equipment Like Cell Phones, DSCs, Media Player, Etc
•ăBattery Charging and Protection Circuits
MAXIMUM RATINGS (T_J = 25°C unless otherwise noted)
Parameter
Symbol Value Unit
Drain-to-Source Voltage
V_DSS
20
V
Gate-to-Source Voltage
V_GS
±12
V
Continuous Drain Steady State T_A = 25°C
I_D
Current (Note 1)
T_A = 85°C
3.0
A
2.2
Continuous Drain
t≤ 5 s
T_A = 25°C
I_D
Current (Note 1)
3.5
A
Power Dissipation Steady State T_A = 25°C
P_D
(Note 1)
t≤ 5 s
0.9
W
1.1
Pulsed Drain Current
t_p = 10 ms
I_DM
10
A
Operating Junction and Storage Temperature T_J, T_STG -50 to °C
150
Source Current (Body Diode)
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
I_S
0.8
A
T_L
260
°C
THERMAL RESISTANCE RATINGS
Parameter
Symbol Value Unit
Junction-to-Ambient – Steady State (Note 1) R_qJA
140 °C/W
Junction-to-Ambient – t ≤ 5 s (Note 1)
R_qJA
110 °C/W
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface Mounted on FR4 Board using 1 in sq pad size (Cu area = 1.127 in sq
[1 oz] including traces).
http://onsemi.com
N-CHANNEL MOSFET
V_(BR)DSS
R_DS(on) Max
I_D Max
20 V
70 mW @ 4.5 V
100 mW @ 2.5 V
3.5 A
D
G
S
N-CHANNEL MOSFET
MARKING
DIAGRAM
1
TSOP-6
CASE 318G
STYLE 13
DN MG
G
1
DN = Specific Device Code
M = Date Code
G
= Pb-Free Package
(Note: Microdot may be in either location)
PIN CONNECTION
D₂ 4
S₁ 5
D₁ 6
3 G₂
2 ^S2
1 ^G1
(Top View)
©Ă Semiconductor Components Industries, LLC, 2008
April, 2008 - Rev. 0
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
1
Publication Order Number:
NTGD3148N/D