NTGD3133P Datasheet, PDF (1/5 Pages) ON Semiconductor – Power MOSFET −20 V, −2.5 A, P−Channel, TSOP−6 Dual

NTGD3133P
Power MOSFET
−20 V, −2.5 A, P−Channel, TSOP−6 Dual
Features
• Reduced Gate Charge for Fast Switching
• −2.5 V Gate Rating
• Leading Edge Trench Technology for Low On Resistance
• Independent Devices to Provide Design Flexibility
• This is a Pb−Free Device
Applications
• Li−Ion Battery Charging
• Load Switch / Power Switching
• DC to DC Conversion
• Portable Devices like PDA’s, Cellular Phones, and Hard Drives
MAXIMUM RATINGS (T_J = 25°C unless otherwise noted)
Parameter
Symbol Value Unit
Drain−to−Source Voltage
V_DSS
−20
V
Gate−to−Source Voltage
V_GS
±12
V
Continuous Drain
Current (Note 1)
Steady ^TA ^{= 25°C}
I_D
State _{TA = 85°C}
−2.3
A
−1.6
t ≤ 5 s T_A = 25°C
−2.5
Power Dissipation
(Note 1)
Steady
P_D
State _{TA = 25°C}
t ≤5 s
1.1
W
1.3
Continuous Drain
Current (Note 2)
Steady T_A = 25°C
I_D
State _{TA = 85°C}
−1.6
A
−1.2
Power Dissipation
(Note 2)
T_A = 25°C
P_D
0.56 W
Pulsed Drain Current
t_p = 10 ms
I_DM
±7.0
A
Operating Junction and Storage Temperature T_J, T_STG −55 to °C
150
Source Current (Body Diode)
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
I_S
−0.8
A
T_L
260
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface Mounted on FR4 Board using 1 in sq pad size (Cu area = 1.127 in sq
[2 oz] including traces).
2. Surface Mounted on FR4 Board using the minimum recommended pad size.
© Semiconductor Components Industries, LLC, 2006
1
July, 2006 − Rev. 0
http://onsemi.com
V_(BR)DSS
−20 V
R_DS(on) MAX
145 mW @ −4.5 V
200 mW @ −2.5 V
I_D MAX
−2.5 A
S1
G1
S2
G2
D1
D2
P−CHANNEL MOSFET P−CHANNEL MOSFET
MARKING
DIAGRAM
1
TSOP6
CASE 318G
SC MG
G
SC = Specific Device Code ¹
M = Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
PIN CONNECTION
G1 ₁
S2 ₂
G2 ₃
6 ^D1
5 S1
4 D2
(Top View)
ORDERING INFORMATION
Device
Package
Shipping^†
NTGD3133PT1G TSOP6 3000/Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
Publication Order Number:
NTGD3133P/D