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NTFG3123P Datasheet, PDF (1/7 Pages) ON Semiconductor – Power MOSFET Single N−Channel | |||
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NTGF3123P
Power MOSFET and
Schottky Diode
20 V, 2.5 A, PâChannel with Schottky
Barrier Diode, TSOPâ6 Dual
Features
⢠FETKY® PâChannel and Schottky Diode
⢠Small Size (3 x 3 mm) Dual TSOPâ6 Package
⢠Leading Edge Trench Technology for Low On Resistance
⢠Low VF Schottky Diode
⢠Common Drain/Cathode for Ease of Board Layout
⢠This is a PbâFree Device
Applications
⢠DCâDC Converters; Configured as Asynchronous Buck
⢠Portable Devices like PDAâs, Cellular Phones, and Hard Drives
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Parameter
Symbol Value Unit
DrainâtoâSource Voltage
VDSS
20
V
GateâtoâSource Voltage
VGS
±12
V
Continuous Drain
Current (Note 1)
Steady TA = 25°C
ID
State TA = 85°C
2.3
A
1.6
t ⤠5 s TA = 25°C
2.5
Power Dissipation
(Note 1)
Steady
PD
State TA = 25°C
t â¤5 s
1.1
W
1.3
Continuous Drain
Current (Note 2)
Power Dissipation
(Note 2)
TA = 25°C
ID
Steady TA = 85°C
State
TA = 25°C
PD
1.7
A
1.2
0.56
W
Pulsed Drain Current
tp = 10 ms
IDM
6.9
A
Operating Junction and Storage Temperature TJ, TSTG â25 to °C
150
Source Current (Body Diode) (Note 2)
Lead Temperature for Soldering Purposes
(1/8â³ from case for 10 s)
IS
0.9
A
TL
260
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface Mounted on FR4 Board using 1 in sq pad size (Cu area = 1.127 in sq
[2 oz] including traces). Both die on.
2. Surface Mounted on FR4 Board using the minimum recommended pad size
(Cu area = 0.0465 in sq [2 oz] including traces). Both die on.
© Semiconductor Components Industries, LLC, 2006
1
April, 2006 â Rev. 0
http://onsemi.com
V(BR)DSS
20 V
MOSFET
RDS(on) MAX
145 mW @ 4.5 V
200 mW @ 2.5 V
ID MAX (Note 1)
2.5 A
VR MAX
20 V
SCHOTTKY DIODE
VF TYP
0.40 V
IF MAX
1.0 A
D
A
G
S
PâCHANNEL MOSFET
K
SCHOTTKY DIODE
MARKING
DIAGRAM
1
TSOP6
CASE 318G
S6 MG
G
1
S6 = Specific Device Code
M = Date Code
G
= PbâFree Package
(Note: Microdot may be in either location)
PIN CONNECTION
A1
S2
G3
6 K/D
5 K/D
4 K/D
(Top View)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 6 of this data sheet.
Publication Order Number:
NTGF3123P/D
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