NTF6P02T3_06 Datasheet, PDF (1/6 Pages) ON Semiconductor – Power MOSFET -6.0 Amps, -20 Volts

NTF6P02T3
Power MOSFET
−6.0 Amps, −20 Volts
P−Channel SOT−223
Features
• Low R_DS(on)
• Logic Level Gate Drive
• Diode Exhibits High Speed, Soft Recovery
• Avalanche Energy Specified
• Pb−Free Package is Available
Typical Applications
• Power Management in Portables and Battery−Powered Products,
i.e.: Cellular and Cordless Telephones and PCMCIA Cards
MAXIMUM RATINGS (T_J = 25°C unless otherwise noted)
Rating
Symbol Value Unit
Drain−to−Source Voltage
V_DSS
−20 Vdc
Gate−to−Source Voltage
V_GS
±8.0 Vdc
Drain Current (Note 1)
− Continuous @ T_A = 25°C
− Continuous @ T_A = 70°C
− Single Pulse (t_p = 10 ms)
I_D
−10 Adc
I_D
−8.4
I_DM
−35 Apk
Total Power Dissipation @ T_A = 25°C
P_D
8.3
W
Operating and Storage Temperature Range
T_J, T_stg − 55
°C
to
+150
Single Pulse Drain−to−Source Avalanche
Energy − Starting T_J = 25°C
(V_DD = −20 Vdc, V_GS = −5.0 Vdc,
I_L(pk) = −10 A, L = 3.0 mH, R_G = 25W)
Thermal Resistance
− Junction to Lead (Note 1)
− Junction to Ambient (Note 2)
− Junction to Ambient (Note 3)
Maximum Lead Temperature for Soldering
Purposes, 1/8″ from case for 10 seconds
E_AS
150 mJ
R_qJL
R_qJA
R_qJA
T_L
°C/W
15
71.4
160
260 °C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Steady State.
2. When surface mounted to an FR4 board using 1” pad size,
(Cu. Area 1.127 sq in), Steady State.
3. When surface mounted to an FR4 board using minimum recommended pad
size, (Cu. Area 0.412 sq in), Steady State.
http://onsemi.com
−6.0 AMPERES
−20 VOLTS
R_DS(on) = 44 mW (Typ.)
P−Channel
D
G
4
1
2
3
SOT−223
CASE 318E
STYLE 3
S
MARKING
DIAGRAM
& PIN
ASSIGNMENT
Drain
4
AWW
6P02 G
G
123
Gate Drain Source
A
= Assembly Location
WW = Work Week
6P02 = Specific Device Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package Shipping^†
NTF6P02T3
NTF6P02T3G
SOT−223 4000/Tape & Reel
SOT−223 4000/Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2006
1
March, 2006 − Rev. 1
Publication Order Number:
NTF6P02T3/D