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NTF6P02 Datasheet, PDF (1/6 Pages) ON Semiconductor – Power MOSFET -10 Amps, -20 Volts | |||
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NTF6P02, NVF6P02
Power MOSFET
-10 Amps, -20 Volts
PâChannel SOTâ223
Features
⢠Low RDS(on)
⢠Logic Level Gate Drive
⢠Diode Exhibits High Speed, Soft Recovery
⢠Avalanche Energy Specified
⢠NVF Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AECâQ101
Qualified and PPAP Capable*
⢠These Devices are PbâFree and are RoHS Compliant
Typical Applications
⢠Power Management in Portables and BatteryâPowered Products,
i.e.: Cellular and Cordless Telephones and PCMCIA Cards
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Rating
Symbol Value Unit
DrainâtoâSource Voltage
VDSS
â20
Vdc
GateâtoâSource Voltage
VGS
±8.0
Vdc
Drain Current (Note 1)
â Continuous @ TA = 25°C
â Continuous @ TA = 70°C
â Single Pulse (tp = 10 ms)
ID
â10
Adc
ID
â8.4
IDM
â35
Apk
Total Power Dissipation @ TA = 25°C
PD
8.3
W
Operating and Storage Temperature Range TJ, Tstg â55 to
°C
+150
Single Pulse DrainâtoâSource Avalanche
Energy â Starting TJ = 25°C
(VDD = â20 Vdc, VGS = â5.0 Vdc,
IL(pk) = â10 A, L = 3.0 mH, RG = 25W)
Thermal Resistance
â Junction to Lead (Note 1)
â Junction to Ambient (Note 2)
â Junction to Ambient (Note 3)
Maximum Lead Temperature for Soldering
Purposes, 1/8â³ from case for 10 seconds
EAS
RqJL
RqJA
RqJA
TL
150
mJ
°C/W
15
71.4
160
260
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Steady State.
2. When surface mounted to an FR4 board using 1â pad size,
(Cu. Area 1.127 sq in), Steady State.
3. When surface mounted to an FR4 board using minimum recommended pad
size, (Cu. Area 0.412 sq in), Steady State.
http://onsemi.com
â10 AMPERES
â20 VOLTS
RDS(on) = 44 mW (Typ.)
S
G
D
PâChannel MOSFET
4
1
23
SOTâ223
CASE 318E
STYLE 3
MARKING DIAGRAM
& PIN ASSIGNMENT
Drain
4
AYW
6P02G
G
1 23
Gate Drain Source
A
= Assembly Location
Y
= Year
W
= Work Week
6P02 = Specific Device Code
G
= PbâFree Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
Shippingâ
NTF6P02T3G
SOTâ223 4000 / Tape &
(PbâFree)
Reel
NVF6P02T3G*
SOTâ223 4000 / Tape &
(PbâFree)
Reel
â For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2013
1
August, 2013 â Rev. 6
Publication Order Number:
NTF6P02T3/D
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