NTF3055L175 Datasheet, PDF (1/6 Pages) ON Semiconductor – Power MOSFET 2.0 A, 60 V, Logic Level

NTF3055L175
Preferred Device
Power MOSFET
2.0 A, 60 V, Logic Level
N−Channel SOT−223
Designed for low voltage, high speed switching applications in
power supplies, converters and power motor controls and bridge
circuits.
Features
• Pb−Free Packages are Available
Applications
• Power Supplies
• Converters
• Power Motor Controls
• Bridge Circuits
MAXIMUM RATINGS (T_C = 25°C unless otherwise noted)
Rating
Symbol Value
Drain−to−Source Voltage
V_DSS
60
Drain−to−Gate Voltage (R_GS = 1.0 MW)
V_DGR
60
Gate−to−Source Voltage
− Continuous
− Non−repetitive (t_p ≤ 10 ms)
V_GS
± 15
± 20
Drain Current
− Continuous @ T_A = 25°C
− Continuous @ T_A = 100°C
− Single Pulse (t_p ≤ 10 ms)
I_D
2.0
I_D
1.2
I_DM
6.0
Total Power Dissipation @ T_A = 25°C (Note 1)
Total Power Dissipation @ T_A = 25°C (Note 2)
Derate above 25°C
P_D
2.1
1.3
0.014
Unit
Vdc
Vdc
Vdc
Vpk
Adc
Apk
W
W
W/°C
Operating and Storage Temperature Range
T_J, T_stg − 55
°C
to 175
Single Pulse Drain−to−Source Avalanche
Energy − Starting T_J = 25°C
(V_DD = 25 Vdc, V_GS = 5.0 Vdc,
I_L(pk) = 3.6 A, L = 10 mH, V_DS = 60 Vdc)
E_AS
65
mJ
Thermal Resistance
− Junction−to−Ambient (Note 1)
− Junction−to−Ambient (Note 2)
R_qJA
R_qJA
°C/W
72.3
114
Maximum Lead Temperature for Soldering
Purposes, 1/8″ from case for 10 seconds
T_L
260 °C
1. When surface mounted to an FR4 board using 1″ pad size, 1 oz. (Cu. Area
0.995 in²).
2. When surface mounted to an FR4 board using minimum recommended pad
size, 2−2.4 oz. (Cu. Area 0.272 in²).
http://onsemi.com
2.0 A, 60 V
R_DS(on) = 175 mW
N−Channel
D
G
S
4
1
2
3
SOT−223
CASE 318E
STYLE 3
MARKING DIAGRAM
5L175 = Device Code
L
= Location Code
WW = Work Week
5L175
LWW
PIN ASSIGNMENT
4 Drain
123
Gate Drain Source
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
Preferred devices are recommended choices for future
use and best overall value.
© Semiconductor Components Industries, LLC, 2004
1
February, 2004 − Rev. 2
Publication Order Number:
NTF3055L175/D