NTF3055L108_16 Datasheet, PDF (1/6 Pages) ON Semiconductor – Power MOSFET

NTF3055L108,
NVF3055L108
Power MOSFET
3.0 A, 60 V, Logic Level, N−Channel
SOT−223
Designed for low voltage, high speed switching applications in power
supplies, converters and power motor controls and bridge circuits.
Features
• NVF Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable
• These Devices are Pb−Free and are RoHS Compliant
Applications
• Power Supplies
• Converters
• Power Motor Controls
• Bridge Circuits
MAXIMUM RATINGS (T_C = 25°C unless otherwise noted)
Rating
Symbol Value
Drain−to−Source Voltage
V_DSS
60
Drain−to−Gate Voltage (R_GS = 1.0 MW)
V_DGR
60
Gate−to−Source Voltage
− Continuous
− Non−repetitive (t_p ≤ 10 ms)
V_GS
± 15
± 20
Drain Current
− Continuous @ T_A = 25°C (Note 1)
− Continuous @ T_A = 100°C (Note 2)
− Single Pulse (t_p ≤ 10 ms)
I_D
3.0
I_D
1.4
I_DM
9.0
Total Power Dissipation @ T_A = 25°C (Note 1)
Total Power Dissipation @ T_A = 25°C (Note 2)
Derate above 25°C
P_D
2.1
1.3
0.014
Unit
Vdc
Vdc
Vdc
Vpk
Adc
Apk
Watts
Watts
W/°C
Operating and Storage Temperature Range
T_J, T_stg − 55
°C
to 175
Single Pulse Drain−to−Source Avalanche
Energy − Starting T_J = 25°C
(V_DD = 25 Vdc, V_GS = 5.0 Vdc,
I_L(pk) = 7.0 Apk, L = 3.0 mH, V_DS = 60 Vdc)
Thermal Resistance
−Junction−to−Ambient (Note 1)
−Junction−to−Ambient (Note 2)
Maximum Lead Temperature for Soldering
Purposes, 1/8″ from case for 10 seconds
E_AS
74
mJ
R_qJA
R_qJA
T_L
°C/W
72.3
114
260 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. When surface mounted to an FR4 board using 1″ pad size, 1 oz.
(Cu. Area 1 in²).
2. When surface mounted to an FR4 board using minimum recommended pad
size, 2 oz. (Cu. Area 0.272 in²).
www.onsemi.com
3.0 A, 60 V
R_DS(on) = 120 mW
N−Channel
D
G
S
4
SOT−223
1
2
3
CASE 318E
STYLE 3
MARKING DIAGRAM
3055L = Device Code
A
= Assembly Location
Y
= Year
AYW
3055LG
G
W
= Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
PIN ASSIGNMENT
4 Drain
123
Gate Drain Source
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
© Semiconductor Components Industries, LLC, 2016
1
July, 2016 − Rev. 9
Publication Order Number:
NTF3055L108/D