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NTF3055-100_16 Datasheet, PDF (1/6 Pages) ON Semiconductor – Power MOSFET | |||
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NTF3055-100,
NVF3055-100
Power MOSFET
3.0 Amps, 60 Volts
NâChannel SOTâ223
Designed for low voltage, high speed switching applications in
power supplies, converters and power motor controls and bridge
circuits.
Features
⢠NVF Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AECâQ101
Qualified and PPAP Capable
⢠These Devices are PbâFree and are RoHS Compliant
Applications
⢠Power Supplies
⢠Converters
⢠Power Motor Controls
⢠Bridge Circuits
MAXIMUM RATINGS (TC = 25°C unless otherwise noted)
Rating
Symbol Value
DrainâtoâSource Voltage
VDSS
60
DrainâtoâGate Voltage (RGS = 10 MW)
VDGR
60
GateâtoâSource Voltage
â Continuous
â Nonârepetitive (tp ⤠10 ms)
VGS
± 20
± 30
Drain Current
â Continuous @ TA = 25°C
â Continuous @ TA = 100°C
â Single Pulse (tp ⤠10 ms)
ID
3.0
ID
1.4
IDM
9.0
Total Power Dissipation @ TA = 25°C (Note 1)
Total Power Dissipation @ TA = 25°C (Note 2)
Derate above 25°C
PD
2.1
1.3
0.014
Unit
Vdc
Vdc
Vdc
Vpk
Adc
Apk
W
W
W/°C
Operating and Storage Temperature Range
TJ, Tstg â 55
°C
to 175
Single Pulse DrainâtoâSource Avalanche
Energy â Starting TJ = 25°C
(VDD = 25 Vdc, VGS = 10 Vdc,
IL(pk) = 7.0 Apk, L = 3.0 mH, VDS = 60 Vdc)
Thermal Resistance
â JunctionâtoâAmbient (Note 1)
â JunctionâtoâAmbient (Note 2)
Maximum Lead Temperature for Soldering
Purposes, 1/8â³ from case for 10 seconds
EAS
RqJA
RqJA
TL
74
mJ
°C/W
72.3
114
260 °C
Stresses exceeding those listed in the Maximum Ratings table may damage
the device. If any of these limits are exceeded, device functionality should not
be assumed, damage may occur and reliability may be affected.
1. When surface mounted to an FR4 board using 1â³ pad size, 1 oz.
(Cu. Area 1.127 sq in).
2. When surface mounted to an FR4 board using minimum recommended pad
size, 2â2.4 oz. (Cu. Area 0.272 sq in).
www.onsemi.com
3.0 A, 60 V
RDS(on) = 110 mW
NâChannel
D
G
S
4
1
2
3
SOTâ223
CASE 318E
STYLE 3
MARKING
DIAGRAM
& PIN
ASSIGNMENT
Drain
4
AWW
3055G
G
123
Gate Drain Source
A
= Assembly Location
WW = Work Week
3055 = Specific Device Code
G
= PbâFree Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package Shippingâ
NTF3055â100T1G SOTâ223 1000 / Tape &
(PbâFree)
Reel
NTF3055â100T3G SOTâ223 4000 / Tape &
(PbâFree)
Reel
NVF3055â100T1G SOTâ223 1000 / Tape &
(PbâFree)
Reel
â For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2016
1
July, 2016 â Rev. 5
Publication Order Number:
NTF3055â100/D
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