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NTF3055-100 Datasheet, PDF (1/6 Pages) ON Semiconductor – Power MOSFET 3.0 Amps 60 Volts N−Channel | |||
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NTF3055â100
Preferred Device
Power MOSFET
3.0 Amps, 60 Volts
NâChannel SOTâ223
Designed for low voltage, high speed switching applications in
power supplies, converters and power motor controls and bridge
circuits.
Features
⢠PbâFree Packages are Available
Applications
⢠Power Supplies
⢠Converters
⢠Power Motor Controls
⢠Bridge Circuits
MAXIMUM RATINGS (TC = 25°C unless otherwise noted)
Rating
Symbol Value
DrainâtoâSource Voltage
VDSS
60
DrainâtoâGate Voltage (RGS = 10 MW)
VDGR
60
GateâtoâSource Voltage
â Continuous
â Nonârepetitive (tp ⤠10 ms)
VGS
± 20
± 30
Drain Current
â Continuous @ TA = 25°C
â Continuous @ TA = 100°C
â Single Pulse (tp ⤠10 ms)
ID
3.0
ID
1.4
IDM
9.0
Total Power Dissipation @ TA = 25°C (Note 1)
Total Power Dissipation @ TA = 25°C (Note 2)
Derate above 25°C
PD
2.1
1.3
0.014
Unit
Vdc
Vdc
Vdc
Vpk
Adc
Apk
W
W
W/°C
Operating and Storage Temperature Range
TJ, Tstg â 55
°C
to 175
Single Pulse DrainâtoâSource Avalanche
Energy â Starting TJ = 25°C
(VDD = 25 Vdc, VGS = 10 Vdc,
IL(pk) = 7.0 Apk, L = 3.0 mH, VDS = 60 Vdc)
Thermal Resistance
â JunctionâtoâAmbient (Note 1)
â JunctionâtoâAmbient (Note 2)
Maximum Lead Temperature for Soldering
Purposes, 1/8â³ from case for 10 seconds
EAS
RqJA
RqJA
TL
74
mJ
°C/W
72.3
114
260 °C
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits
are exceeded, device functional operation is not implied, damage may occur
and reliability may be affected.
1. When surface mounted to an FR4 board using 1â³ pad size, 1 oz.
(Cu. Area 1.127 sq in).
2. When surface mounted to an FR4 board using minimum recommended pad
size, 2â2.4 oz. (Cu. Area 0.272 sq in).
http://onsemi.com
3.0 A, 60 V
RDS(on) = 110 mW
NâChannel
D
G
4
1
2
3
SOTâ223
CASE 318E
STYLE 3
S
MARKING
DIAGRAM
& PIN
ASSIGNMENT
Drain
4
AWW
3055 G
G
123
Gate Drain Source
A
= Assembly Location
WW = Work Week
3055 = Specific Device Code
G
= PbâFree Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package Shippingâ
NTF3055â100T1
NTF3055â100T1G
SOTâ223 1000/Tape & Reel
SOTâ223 1000/Tape & Reel
(PbâFree)
NTF3055â100T3 SOTâ223 4000/Tape & Reel
NTF3055â100T3G SOTâ223 4000/Tape & Reel
(PbâFree)
NTF3055â100T3LF SOTâ223 4000/Tape & Reel
â For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Preferred devices are recommended choices for future use
and best overall value.
© Semiconductor Components Industries, LLC, 2006
1
February, 2006 â Rev. 3
Publication Order Number:
NTF3055â100/D
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