NTF2955 Datasheet, PDF (1/6 Pages) ON Semiconductor – Power MOSFET

NTF2955
Power MOSFET
−60 V, −2.6 A, Single P−Channel SOT−223
Features
• TMOS7 Design for low R_DS(on)
• Withstands High Energy in Avalanche and Commutation Modes
Applications
• Power Supplies
• PWM Motor Control
• Converters
• Power Management
MAXIMUM RATINGS (T_J = 25°C unless otherwise noted)
Parameter
Symbol Value Unit
Drain−to−Source Voltage
V_DSS
−60
V
Gate−to−Source Voltage
V_GS
±20
V
Continuous Drain
Current (Note 1)
Steady T_A = 25°C
I_D
State
T_A = 85°C
−2.6 A
−2.0
Power Dissipation
(Note 1)
Steady T_A = 25°C P_D
State
2.3
W
Continuous Drain
Current (Note 2)
Power Dissipation
(Note 2)
Steady
State
T_A = 25°C
T_A = 85°C
T_A = 25°C
Pulsed Drain Current
tp = 10 ms
Operating Junction and Storage Temperature
Single Pulse Drain−to−Source Avalanche
Energy (V_DD = 25 V, V_G = 10 V, I_PK = 6.7 A,
L = 10 mH, R_G = 25 W)
Lead Temperature for Soldering Purposes
(1/8” from case for 10 s)
I_D
P_D
I_DM
T_J,
T_STG
EAS
T_L
−1.7 A
−1.3
1.0
W
−10.4 A
−55 to °C
175
225 mJ
260 °C
THERMAL RESISTANCE RATINGS
Parameter
Symbol Max Unit
Junction−to−Tab (Drain) − Steady State (Note 2) R_qJC
14 °C/W
Junction−to−Ambient − Steady State (Note 1)
R_qJA
65
Junction−to−Ambient − Steady State (Note 2)
R_qJA
150
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. When surface mounted to an FR4 board using 1 in. pad size
(Cu. area = 1.127 in² [1 oz] including traces)
2. When surface mounted to an FR4 board using the minimum recommended
pad size (Cu. area = 0.341 in²)
http://onsemi.com
V_(BR)DSS
−60 V
R_DS(on) TYP
145 mW @ −10 V
I_D MAX
−2.6 A
P−Channel
D
G
S
1
2
3
4
SOT−223
CASE 318E
STYLE 3
2955
L
WW
= Device Code
= Location Code
= Work Week
MARKING
DIAGRAM
2955
LWW
PIN ASSIGNMENT
4 Drain
123
Gate Drain Source
ORDERING INFORMATION
Device
Package
Shipping^†
NTF2955T1
NTF2955T3
SOT−223
SOT−223
1000/Tape & Reel
4000/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2004
1
August, 2004 − Rev. 1
Publication Order Number:
NTF2955/D