NTDV20P06LT4G Datasheet, PDF (1/7 Pages) ON Semiconductor – Power MOSFET −60 V, −15.5 A, Single P−Channel, DPAK

NTD20P06L, NTDV20P06L
Power MOSFET
−60 V, −15.5 A, Single P−Channel, DPAK
Features
• Withstands High Energy in Avalanche and Commutation Modes
• Low Gate Charge for Fast Switching
• AEC Q101 Qualified − NTDV20P06L
• These Devices are Pb−Free and are RoHS Compliant
Applications
• Bridge Circuits
• Power Supplies, Power Motor Controls
• DC−DC Conversion
MAXIMUM RATINGS (T_J = 25°C unless otherwise noted)
Parameter
Symbol Value Unit
Drain−to−Source Voltage
V_DSS
−60
V
Gate−to−Source
Continuous
V_GS
$20
V
Voltage
Non−Repetitive t_p v10 ms V_GSM $30
Continuous
Drain Current
(Note 1)
Steady State T_A = 25°C
I_D
−15.5 A
Power Dissipa- Steady State T_A = 25°C
P_D
tion (Note 1)
65
W
Pulsed Drain
Current
t_p = 10 ms
I_DM
$50
A
Operating Junction and Storage Temperature
Single Pulse Drain−to−Source Avalanche
Energy (V_DD = 25 V, V_GS = 5 V, I_PK = 15 A,
L = 2.7 mH, R_G = 25 W)
Lead Temperature for Soldering Purposes
(1/8” from case for 10 s)
T_J, −55 to °C
T_STG
175
E_AS
304 mJ
T_L
260 °C
THERMAL RESISTANCE RATINGS
Parameter
Symbol Max Unit
Junction−to−Case (Drain)
R_qJC
2.3 °C/W
Junction−to−Ambient – Steady State (Note 1)
R_qJA
80
Junction−to−Ambient – Steady State (Note 2)
R_qJA
110
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface−mounted on FR4 board using 1 in sq. pad size
(Cu area = 1.127 in sq. [1 oz] including traces)
2. Surface−mounted on FR4 board using the minimum recommended pad size
(Cu area = 0.412 in sq.)
http://onsemi.com
V_(BR)DSS
−60 V
R_DS(on) TYP
130 mW @ −5.0 V
I_D MAX
(Note 1)
−15.5 A
P−Channel
D
G
4
12
3
DPAK
CASE 369C
STYLE 2
4
S
MARKING DIAGRAMS
4
Drain
1
Gate
2
Drain
3
Source
4
Drain
1
23
IPAK/DPAK
CASE 369D
STYLE 2
12 3
Gate Drain Source
20P06L
A
Y
WW
G
Device Code
= Assembly Location
= Year
= Work Week
= Pb−Free Package
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
© Semiconductor Components Industries, LLC, 2011
1
August, 2011 − Rev. 6
Publication Order Number:
NTD20P06L/D