English
Language : 

NTD95N02R Datasheet, PDF (1/6 Pages) ON Semiconductor – Power MOSFET 95 Amps, 24 Volts N−Channel DPAK
NTD95N02R
Power MOSFET
95 Amps, 24 Volts
N−Channel DPAK
Features
• High Power and Current Handling Capability
• Fast Switching Performance
• Low RDS(on) to Minimize Conduction Loss
• Low Gate Charge to Minimize Switching Losses
• Pb−Free Packages are Available
Applications
• CPU Motherboard Vcore Applications
• High Frequency DC−DC Converters
• Motor Drives
• Bridge Circuits
MAXIMUM RATINGS (TJ = 25°C unless otherwise specified)
Parameter
Symbol Value Unit
Drain−to−Source Voltage
Gate−to−Source Voltage
Thermal Resistance, Junction−to−Case
Total Power Dissipation @ TA = 25°C
Drain Current –
− Continuous @ TA= 25°C, Limited by Package
− Continuous @ TA= 25°C, Limited by Wires
Thermal Resistance, Junction−to− Ambient
(Note 1)
− Total Power Dissipation @ TA = 25°C
− Drain Current − Continuous @ TA= 25°C
Thermal Resistance, Junction−to−Ambient
(Note 2)
− Total Power Dissipation @ TA = 25°C
− Drain Current − Continuous @ TA= 25°C
Operating Junction and Storage Temperature
VDSS
VGS
RqJC
PD
ID
ID
RqJA
PD
ID
RqJA
PD
ID
TJ,
TSTG
24
V
±20
V
1.45 °C/W
86
W
95
A
32
A
52 °C/W
2.4
W
15.8
A
100 °C/W
1.25
W
12
A
−55 to °C
150
Continuous Source Current (Body Diode)
Single Pulse Drain−to−Source Avalanche
Energy – (VDD = 25 V, VG = 10, IPK = 13 A,
L = 1 mH, RG= 25 W)
Lead Temperature for Soldering Purposes
(1/8 in from case for 10 seconds)
IS
45
A
EAS
84
mJ
TL
260
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface mounted on FR4 board using 1 in sq pad size (Cu area = 1.127 in sq
[1 oz] including traces).
2. Surface mounted on FR4 board using the minimum recommended pad size
(Cu area = 0.412 in sq).
© Semiconductor Components Industries, LLC, 2006
1
July, 2006 − Rev. 3
http://onsemi.com
V(BR)DSS
RDS(ON) TYP
ID MAX*
24 V
4.5 mW @ 10 V
5.9 mW @ 4.5 V
95 A
*ID MAX in the product summary table is continuous
and steady at 25°C.
D
G
S
MARKING DIAGRAMS
& PIN ASSIGNMENTS
12
3
4
Drain
4
DPAK
CASE 369AA
(Surface Mount)
STYLE 2
1
Gate
2
Drain
3
Source
4
1
2
3
DPAK
CASE 369D
(Straight Lead)
STYLE 2
4
Drain
12 3
Gate Drain Source
Y
WW
T95N02R
G
= Year
= Work Week
= Device Code
= Pb−Free Package
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
Publication Order Number:
NTD95N02R/D