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NTD80N02 Datasheet, PDF (1/8 Pages) ON Semiconductor – Power MOSFET
NTD80N02
Power MOSFET
24 V, 80 A, N−Channel DPAK
Designed for low voltage, high speed switching applications in
power supplies, converters and power motor controls and bridge
circuits.
Features
• Pb−Free Packages are Available
Typical Applications
• Power Supplies
• Converters
• Power Motor Controls
• Bridge Circuits
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Rating
Symbol Value Unit
Drain−to−Source Voltage
Gate−to−Source Voltage − Continuous
Drain Current − Continuous @ TC = 25°C
Drain Current − Single Pulse (tp = 10 ms)
Total Power Dissipation @ TC = 25°C
Operating and Storage
Temperature Range
VDSS
VGS
ID
IDM
PD
TJ, Tstg
24
±20
80*
200
75
−55 to
150
Vdc
Vdc
Adc
Watts
°C
Single Pulse Drain−to−Source Avalanche
Energy − Starting TJ = 25°C
(VDD = 24 Vdc, VGS = 10 Vdc,
IL = 17 Apk, L = 5.0 mH, RG = 25 Ω)
Thermal Resistance
− Junction−to−Case
− Junction−to−Ambient (Note 1)
− Junction−to−Ambient (Note 2)
Maximum Lead Temperature for Soldering
Purposes, 1/8″ from case for 10 seconds
EAS
RθJC
RθJA
RθJA
TL
733
mJ
°C/W
1.65
67
120
260
°C
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. When surface mounted to an FR4 board using 1″ pad size,
(Cu Area 1.127 in2).
2. When surface mounted to an FR4 board using the minimum recommended
pad size, (Cu Area 0.412 in2).
*Chip current capability limited by package.
http://onsemi.com
V(BR)DSS
24 V
RDS(on) TYP
5.0 mW
ID MAX
80 A
N−Channel
D
G
S
4
4
4
12
3
12
3
1 23
CASE 369AA CASE 369C CASE 369D
DPAK
DPAK
DPAK
(Surface Mount) (Surface Mount)(Straight Lead)
STYLE 2
STYLE 2
STYLE 2
MARKING DIAGRAMS
& PIN ASSIGNMENTS
4
Drain
4
Drain
1
Gate
23
Drain Source
1
3
Gate 2 Source
Drain
Y
WW
80N02
= Year
= Work Week
= Device Code
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
© Semiconductor Components Industries, LLC, 2004
1
December, 2004 − Rev. 4
Publication Order Number:
NTD80N02/D