NTD78N03-1G Datasheet, PDF (1/7 Pages) ON Semiconductor – Power MOSFET 25 V, 78 A, Single N−Channel, DPAK

NTD78N03
Power MOSFET
25 V, 78 A, Single N−Channel, DPAK
Features
• Low R_DS(on)
• Optimized Gate Charge
• Pb−Free Packages are Available
Applications
• Desktop VCORE
• DC−DC Converters
• Low Side Switch
MAXIMUM RATINGS (T_J = 25°C unless otherwise noted)
Parameter
Symbol Value Unit
Drain−to−Source Voltage
Gate−to−Source Voltage
Continuous Drain
Current (Note 1)
Power Dissipation
(Note 1)
V_DSS
25
V
V_GS
"20
V
T_C = 25°C
I_D
14.8
A
T_C = 85°C
11.5
T_C = 25°C P_D
2.3
W
Continuous Drain
Current (Note 2)
Power Dissipation
(Note 2)
T_C = 25°C
I_D
Steady T_C = 85°C
State _{TC = 25°C}
P_D
11.4
A
8.8
1.4
W
Continuous Drain
Current (R_qJC)
Power Dissipation
(R_qJC)
T_C = 25°C
I_D
T_C = 85°C
T_C = 25°C P_D
78
A
56
64
W
Pulsed Drain Current
t_p = 10 ms
I_DM
210
A
Current Limited by Package
T_A = 25°C I_DmaxPkg
45
A
Drain to Source dV/dt
dV/dt
8.0
V/ns
Operating Junction and Storage Temperature T_J, T_stg −55 to 175 °C
Source Current (Body Diode)
Single Pulse Drain−to−Source Avalanche
Energy (V_DD = 24 V, V_GS = 10 V,
L = 5.0 mH, I_L(pk) = 17 A, R_G = 25 W)
I_S
78
A
E_AS
722.5 mJ
Lead Temperature for Soldering Purposes
T_L
(1/8″ from case for 10 seconds)
260
°C
THERMAL RESISTANCE
Junction−to−Case (Drain)
R_qJC
1.95
°C/W
Junction−to−Ambient − Steady State (Note 1) R_qJA
65
Junction−to−Ambient − Steady State (Note 2) R_qJA
110
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface−mounted on FR4 board using 1 in sq pad size (Cu area = 1.127 in
sq [1 oz] including traces).
2. Surface−mounted on FR4 board using the minimum recommended pad size.
http://onsemi.com
V_(BR)DSS
25 V
R_DS(on) TYP
4.6 @ 10 V
6.5 @ 4.5 V
D
I_D MAX
78 A
N−Channel
G
S
4
4
4
12
3
1
2
3
CASE 369AA CASE 369D
DPAK
DPAK
(Bend Lead) (Straight Lead)
STYLE 2
STYLE 2
1 ₂₃
CASE 369AD
IPAK
(Straight Lead)
4
Drain
MARKING DIAGRAMS
& PIN ASSIGNMENTS
4
Drain
4
Drain
2
1 ^Drain 3
Gate Source
1 23
Gate Drain Source
1
23
Gate Drain Source
Y
= Year
WW = Work Week
78N03 = Device Code
G
= Pb−Free Package
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
© Semiconductor Components Industries, LLC, 2006
1
September, 2006 − Rev. 6
Publication Order Number:
NTD78N03/D