NTD5862NT4G Datasheet, PDF (1/8 Pages) ON Semiconductor – N-Channel Power MOSFET 60 V, 98 A, 5.7 m

NTD5862N, NTP5862N
N-Channel Power MOSFET
60 V, 98 A, 5.7 mW
Features
• Low R_DS(on)
• High Current Capability
• 100% Avalanche Tested
• These Devices are Pb−Free, Halogen Free and are RoHS Compliant
MAXIMUM RATINGS (T_J = 25°C unless otherwise noted)
Parameter
Symbol Value Unit
Drain−to−Source Voltage
V_DSS
60
V
Gate−to−Source Voltage − Continuous
V_GS
"20
V
Gate−to−Source Voltage
− Non−Repetitive (t_p < 10 ms)
V_GS
"30
V
Continuous Drain Cur-
T_C = 25°C
I_D
rent (R_qJC) (Note 1)
Steady T_C = 100°C
Power Dissipation
State _{TC = 25°C}
P_D
(R_qJC)
98
A
69
115
W
Pulsed Drain Current
t_p = 10 ms
I_DM
335
A
Operating Junction and Storage Temperature T_J, T_stg −55 to °C
175
Source Current (Body Diode)
Single Pulse Drain−to−Source Avalanche
Energy (L = 0.3 mH)
I_S
96
A
E_AS
205 mJ
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
T_L
260
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
THERMAL RESISTANCE MAXIMUM RATINGS
Parameter
Symbol
Junction−to−Case (Drain)
R_qJC
Junction−to−Ambient − Steady State (Note 2) R_qJA
1. Limited by package to 50 A continuous.
2. Surface−mounted on FR4 board using 1 in sq pad size
(Cu area = 1.127 in sq [2 oz] including traces.
Value
1.3
37
Unit
°C/W
http://onsemi.com
V_(BR)DSS
60 V
R_DS(on) MAX
5.7 mW @ 10 V
I_D MAX
98 A
D
G
S
N−CHANNEL MOSFET
4
4
4
12
3
DPAK
1
2
3
CASE 369C
DPAK
(Surface Mount) ^{CASE 369D}
STYLE 2
(Straight Lead)
STYLE 2
1
2
3
TO−220AB
CASE 221A
STYLE 5
4
Drain
MARKING DIAGRAMS
& PIN ASSIGNMENT
4
4
Drain
Drain
NTP
5862NG
2
1 ^Drain 3
Gate Source
AYWW
1
Gate
3
Source
1 23
Gate Drain Source
2
A
= Assembly Location
Drain
Y
= Year
WW = Work Week
5862N = Device Code
G
= Pb−Free Package
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
© Semiconductor Components Industries, LLC, 2012
1
July, 2012 − Rev. 2
Publication Order Number:
NTD5862N/D