NTD5807N Datasheet, PDF (1/6 Pages) ON Semiconductor – Power MOSFET 40 V, 23 A, Single N−Channel, DPAK/IPAK

NTD5807N
Power MOSFET
40 V, 23 A, Single N−Channel, DPAK/IPAK
Features
• Low R_DS(on)
• High Current Capability
• Avalanche Energy Specified
• These are Pb−Free Devices
Applications
• CCFL Backlight
• DC Motor Control
• Class D Amplifier
• Power Supply Secondary Side Synchronous Rectification
MAXIMUM RATINGS (T_J = 25°C unless otherwise noted)
Parameter
Symbol Value Unit
Drain−to−Source Voltage
V_DSS
40
V
Gate−to−Source Voltage − Continuous
V_GS
"20
V
Gate−to−Source Voltage
− Non−Repetitive (t_p < 10 mS)
V_GS
"30
V
Continuous Drain
Current (R_qJC)
(Note 1)
Power Dissipation
(R_qJC) (Note 1)
T_C = 25°C
I_D
Steady T_C = 100°C
State
T_C = 25°C
P_D
23
A
16
33
W
Pulsed Drain Current
t_p = 10 ms
I_DM
45
A
Operating Junction and Storage Temperature T_J, T_stg −55 to °C
175
Source Current (Body Diode)
I_S
Single Pulse Drain−to−Source Avalanche
E_AS
Energy (V_DD = 50 V, V_GS = 10 V, R_G = 25 W,
I_L(pk) = 14 A, L = 0.3 mH, V_DS = 40 V)
Lead Temperature for Soldering Purposes
T_L
(1/8″ from case for 10 s)
23
A
29.4 mJ
260
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
THERMAL RESISTANCE MAXIMUM RATINGS
Parameter
Symbol
Junction−to−Case (Drain)
R_qJC
Junction−to−Ambient − Steady State (Note 1) R_qJA
1. Surface−mounted on FR4 board using 1 in sq pad size
(Cu area = 1.127 in sq [1 oz] including traces.
Value
4.5
107
Unit
°C/W
http://onsemi.com
V_(BR)DSS
40 V
R_DS(on) MAX
37 mW @ 4.5 V
31 mW @ 10 V
D
I_D MAX
16 A
23 A
G
S
N−CHANNEL MOSFET
4
4
12
3
DPAK
CASE 369AA
(Surface Mount)
STYLE 2
1
2
3
IPAK
CASE 369D
(Straight Lead
DPAK)
MARKING DIAGRAMS
& PIN ASSIGNMENT
4
Drain
4
Drain
2
1 ^Drain 3
Gate Source
1 23
Gate Drain Source
Y
= Year
WW = Work Week
5807N = Device Code
G
= Pb−Free Package
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
© Semiconductor Components Industries, LLC, 2010
1
February, 2010 − Rev. 2
Publication Order Number:
NTD5807N/D