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NTD5805N_14 Datasheet, PDF (1/6 Pages) ON Semiconductor – Power MOSFET | |||
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NTD5805N, NVD5805N
Power MOSFET
40 V, 51 A, Single NâChannel, DPAK
Features
⢠Low RDS(on)
⢠High Current Capability
⢠Avalanche Energy Specified
⢠NVD Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AECâQ101
Qualified and PPAP Capable
⢠These Devices are PbâFree and are RoHS Compliant
Applications
⢠LED Backlight Driver
⢠CCFL Backlight
⢠DC Motor Control
⢠Power Supply Secondary Side Synchronous Rectification
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Parameter
Symbol Value Unit
DrainâtoâSource Voltage
VDSS
40
V
GateâtoâSource Voltage â Continuous
VGS
±20
V
GateâtoâSource Voltage
â NonâRepetitive (tp < 10 mS)
VGS
±30
V
Continuous Drain
Current (RqJC)
(Note 1)
Power Dissipation
(RqJC) (Note 1)
TC = 25°C
ID
Steady TC = 100°C
State
TC = 25°C
PD
51
A
36
47
W
Pulsed Drain Current
tp = 10 ms
IDM
85
A
Operating Junction and Storage Temperature TJ, Tstg â55 to °C
175
Source Current (Body Diode)
IS
30
A
Single Pulse DrainâtoâSource Avalanche
EAS
Energy (VDD = 50 V, VGS = 10 V, RG = 25 W,
IL(pk) = 40 A, L = 0.1 mH, VDS = 40 V)
80
mJ
Lead Temperature for Soldering Purposes
(1/8â³ from case for 10 s)
TL
260
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
THERMAL RESISTANCE MAXIMUM RATINGS
Parameter
Symbol Value Unit
JunctionâtoâCase (Drain)
RqJC
3.2 °C/W
JunctionâtoâAmbient â Steady State (Note 1) RqJA
107
1. Surfaceâmounted on FR4 board using the minimum recommended pad size.
http://onsemi.com
V(BR)DSS
40 V
RDS(on) MAX
16 mW @ 5.0 V
9.5 mW @ 10 V
D
ID MAX
51 A
NâChannel
G
S
4
12
3
DPAK
CASE 369C
(Surface Mount)
STYLE 2
MARKING DIAGRAM
& PIN ASSIGNMENT
4
Drain
2
1 Drain 3
Gate Source
A
= Assembly Location*
Y
= Year
WW = Work Week
5805N = Device Code
G
= PbâFree Package
* The Assembly Location code (A) is front side
optional. In cases where the Assembly Location is
stamped in the package, the front side assembly
code may be blank.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
© Semiconductor Components Industries, LLC, 2014
1
August, 2014 â Rev. 5
Publication Order Number:
NTD5805N/D
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