NTD5802N Datasheet, PDF (1/6 Pages) ON Semiconductor – Power MOSFET 40 V, Single N−Channel, 101 A DPAK

NTD5802N
Power MOSFET
40 V, Single N−Channel, 101 A DPAK
Features
• Low R_DS(on) to Minimize Conduction Losses
• Low Capacitance to Minimize Driver Losses
• Optimized Gate Charge to Minimize Switching Losses
• MSL 1/260°C
• AEC Q101 Qualified
• 100% Avalanche Tested
• These are Pb−Free Devices
Applications
• CPU Power Delivery
• DC−DC Converters
• Motor Driver
MAXIMUM RATINGS (T_J = 25°C unless otherwise noted)
Parameter
Symbol Value Unit
Drain−to−Source Voltage
V_DSS
40
V
Gate−to−Source Voltage
V_GS
"20
V
Continuous Drain Cur-
rent (R_qJC) (Note 1)
T_C = 25°C
I_D
T_C = 85°C
101
A
78
Power Dissipation
(R_qJC) (Note 1)
T_C = 25°C
P_D
Steady
Continuous Drain Cur- ^State T_A = 25°C
I_D
rent (R_qJA) (Note 1)
T_A = 85°C
93.75 W
16.4
A
12.7
Power Dissipation
(R_qJA) (Note 1)
T_A = 25°C
P_D
2.5
W
Pulsed Drain Current t_p=10ms T_A = 25°C I_DM
300
A
Current Limited by Package
T_A = 25°C I_DmaxPkg
45
A
Operating Junction and Storage Temperature T_J, T_stg −55 to °C
175
Source Current (Body Diode)
Drain to Source dV/dt
I_S
dV/dt
50
A
6.0 V/ns
Single Pulse Drain−to−Source Avalanche En-
E_AS
ergy (V_DD = 32 V, V_GS = 10 V,
L = 0.3 mH, I_L(pk) = 40 A, R_G = 25 W)
240 mJ
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
T_L
260
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
http://onsemi.com
V_(BR)DSS
40 V
R_DS(on)
4.4 mW @ 10 V
7.8 mW @ 5.0 V
D
I_D
101 A
50 A
N−Channel
G
S
4
12
3
CASE 369C
DPAK
(Bent Lead)
STYLE 2
MARKING DIAGRAMS
& PIN ASSIGNMENT
4
Drain
2
1 ^Drain 3
Gate Source
Y
= Year
WW = Work Week
5802N = Device Code
G
= Pb−Free Package
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
© Semiconductor Components Industries, LLC, 2009
1
April, 2009 − Rev. 4
Publication Order Number:
NTD5802N/D