NTD5414N_14 Datasheet, PDF (1/6 Pages) ON Semiconductor – Power MOSFET

NTD5414N, NVD5414N
Power MOSFET
24 A, 60 V Single N−Channel DPAK
Features
• Low R_DS(on)
• High Current Capability
• Avalanche Energy Specified
• NVD Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable
• These Devices are Pb−Free and are RoHS Compliant
Applications
• LED Lighting and LED Backlight Drivers
• DC−DC Converters
• DC Motor Drivers
• Power Supplies Secondary Side Synchronous Rectification
MAXIMUM RATINGS (T_J = 25°C Unless otherwise specified)
Parameter
Symbol Value Unit
Drain−to−Source Voltage
V_DSS
60
V
Gate−to−Source Voltage − Continuous
V_GS
$20
V
Gate−to−Source Voltage − Nonrepetitive
(T_P < 10 ms)
V_GS
$30
V
Continuous Drain
Steady T_C = 25°C
I_D
Current R_qJC
State
(Note 1)
T_C = 100°C
24
A
16
Power Dissipation
Steady T_C = 25°C
P_D
R_qJC (Note 1)
State
55
W
Pulsed Drain Current
t_p = 10 ms
I_DM
75
A
Operating and Storage Temperature Range
T_J, T_stg −55 to °C
+175
Source Current (Body Diode)
Single Pulse Drain−to−Source Avalanche
Energy − Starting T_J = 25°C
(V_DD = 50 V_dc, V_GS = 10 V, I_L(pk) = 24 A,
L = 0.3 mH, R_G = 25 W)
Lead Temperature for Soldering
Purposes, 1/8″ from Case for 10 Seconds
I_S
24
A
E_AS
86.4 mJ
T_L
260
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
THERMAL RESISTANCE RATINGS
Parameter
Symbol Max Unit
Junction−to−Case (Drain) Steady State
(Note 1)
R_qJC
R_qJA
1. Surface mounted on FR4 board using 1 sq in pad size,
(Cu Area 1.127 sq in [1 oz] including traces).
2.7 °C/W
58.6
© Semiconductor Components Industries, LLC, 2014
1
August, 2014 − Rev. 2
http://onsemi.com
V_(BR)DSS
60 V
R_DS(ON) MAX
37 mW @ 10 V
I_D MAX
(Note 1)
24 A
N−Channel
D
G
S
4
12
3
DPAK
CASE 369AA
STYLE 2
MARKING DIAGRAMS
& PIN ASSIGNMENT
4
Drain
1
Gate
2
Drain
3
Source
A
Y
WW
5414N
G
= Assembly Location*
= Year
= Work Week
= Specific Device Code
= Pb−Free Device
* The Assembly Location code (A) is front side
optional. In cases where the Assembly Location is
stamped in the package, the front side assembly
code may be blank.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
Publication Order Number:
NTD5414N/D