NTD5407N_16 Datasheet, PDF (1/6 Pages) ON Semiconductor – Power MOSFET

NTD5407N, STD5407N,
NVD5407N
Power MOSFET
40 V, 38 A, Single N−Channel, DPAK
Features
• Low R_DS(on)
• High Current Capability
• Low Gate Charge
• STD Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable*
• These Devices are Pb−Free and are RoHS Compliant
Applications
• Electronic Brake Systems
• Electronic Power Steering
• Bridge Circuits
MAXIMUM RATINGS (T_J = 25°C unless otherwise stated)
Parameter
Symbol Value Unit
Drain−to−Source Voltage
V_DSS
40
V
Gate−to−Source Voltage
V_GS
±20
V
Continuous Drain
Current − R_qJC
Steady ^{TC = 25°C}
I_D
State _{TC = 100°C}
38
A
27
Power Dissipation − Steady T_C = 25°C
P_D
R_qJC
State
75
W
Continuous Drain
Steady T_A = 25°C
I_D
Current R_qJA (Note 1) State _{TA = 100°C}
7.6
A
5.3
Power Dissipation − Steady T_A = 25°C
P_D
R_qJA (Note 1)
State
2.9
W
Pulsed Drain Current
t_p = 10 ms
I_DM
75
A
Operating Junction and Storage Temperature
T_J,
−55 to _°C
T_STG
175
Source Current (Body Diode)
I_S
36
A
Single Pulse Drain−to Source Avalanche
Energy − (V_DD = 50 V, V_GS = 10 V, I_PK = 17 A,
L = 1 mH, R_G = 25 W)
EAS
150 mJ
Lead Temperature for Soldering Purposes
(1/8” from case for 10 s)
T_L
260
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
THERMAL RESISTANCE RATINGS (Note 1)
Parameter
Symbol Max Unit
Junction−to−Case (Drain)
R_θJC
Junction−to−Ambient (Note 1)
R_θJA
1. Surface mounted on FR4 board using 1 sq in pad size,
(Cu Area 1.127 sq in [2 oz] including traces).
2.0 °C/W
52 °C/W
© Semiconductor Components Industries, LLC, 2014
1
October, 2016 − Rev. 7
www.onsemi.com
V_(BR)DSS
40 V
R_DS(ON) TYP
21 mW @ 10 V
I_D MAX
(Note 1)
38 A
N−Channel
4
D
12
3
DPAK
CASE 369C
G
STYLE 2
S
MARKING DIAGRAM
1
AYWW
54
07NG
A
Y
WW
5407N
G
= Assembly Location*
= Year
= Work Week
= Specific Device Code
= Pb−Free Device
* The Assembly Location code (A) is front side
optional. In cases where the Assembly Location is
stamped in the package, the front side assembly
code may be blank.
ORDERING INFORMATION
Device
Package
Shipping†
NTD5407NT4G
STD5407NT4G*
NVD5407NT4G*
DPAK
(Pb−Free)
DPAK
(Pb−Free)
DPAK
(Pb−Free)
2500 / Tape &
Reel
2500 / Tape &
Reel
2500 / Tape &
Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Publication Order Number:
NTD5407N/D