NTD5406N_16 Datasheet, PDF (1/6 Pages) ON Semiconductor – Power MOSFET

NTD5406N, STD5406N
Power MOSFET
40 V, 70 A, Single N−Channel, DPAK
Features
• Low R_DS(on)
• High Current Capability
• Low Gate Charge
• STD Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable
• These Devices are Pb−Free and are RoHS Compliant
Applications
• Electronic Brake Systems
• Electronic Power Steering
• Bridge Circuits
MAXIMUM RATINGS (T_J = 25°C unless otherwise stated)
Parameter
Symbol Value Unit
Drain−to−Source Voltage
V_DSS
40
V
Gate−to−Source Voltage
V_GS
±20
V
Continuous Drain
Current − R_qJC
Steady ^{TC = 25°C}
I_D
State _{TC = 125°C}
70
A
40
Power Dissipation −
R_qJC
Steady
State
T_C = 25°C
P_D
100
W
Continuous Drain
Current − R_qJA
(Note 1)
Steady T_A = 25°C
I_D
State
T_A = 125°C
12.2
A
7.0
Power Dissipation −
R_qJA (Note 1)
Steady T_A = 25°C
State
Pulsed Drain Current
t_p = 10 ms
Operating Junction and Storage Temperature
P_D
I_DM
T_J,
T_STG
3.0
W
150
A
−55 to _°C
175
Source Current (Body Diode) Pulsed
Single Pulse Drain−to Source Avalanche
Energy − (V_DD = 50 V, V_GS = 10 V, I_PK = 30 A,
L = 1 mH, R_G = 25 W)
Lead Temperature for Soldering Purposes
(1/8” from case for 10 s)
I_S
EAS
T_L
63.5
A
450 mJ
260
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
THERMAL RESISTANCE RATINGS (Note 1)
Parameter
Symbol Max Unit
Junction−to−Case (Drain)
R_θJC
Junction−to−Ambient (Note 1)
R_θJA
1. Surface mounted on FR4 board using 1 sq in pad size,
(Cu Area 1.127 sq in [2 oz] including traces).
1.5 °C/W
49
© Semiconductor Components Industries, LLC, 2016
1
November, 2016 − Rev. 8
www.onsemi.com
V_(BR)DSS
40 V
R_DS(ON) TYP
8.7 mΩ @ 10 V
I_D MAX
(Note 1)
70 A
D
N−Channel
G
4
12
3
S
DPAK
CASE 369C
STYLE 2
MARKING DIAGRAM
1
AYWW
54
06NG
A
Y
WW
5406N
G
= Assembly Location*
= Year
= Work Week
= Specific Device Code
= Pb−Free Device
* The Assembly Location code (A) is front side
optional. In cases where the Assembly Location is
stamped in the package, the front side assembly
code may be blank.
ORDERING INFORMATION
Device
Package Shipping†
NTD5406NT4G
DPAK 2500 / Tape &
(Pb−Free)
Reel
STD5406NT4G*
DPAK 2500 / Tape &
(Pb−Free)
Reel
STD5406NT4G−VF01 DPAK 2500 / Tape &
(Pb−Free)
Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Publication Order Number:
NTD5406N/D