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NTD4969N Datasheet, PDF (1/7 Pages) ON Semiconductor – Power MOSFET 30 V, 41 A, Single N−Channel, DPAK/IPAK CPU Power Delivery
NTD4969N
Power MOSFET
30 V, 41 A, Single N−Channel, DPAK/IPAK
Features
• Low RDS(on) to Minimize Conduction Losses
• Low Capacitance to Minimize Driver Losses
• Optimized Gate Charge to Minimize Switching Losses
• Three Package Variations for Design Flexibility
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Applications
• CPU Power Delivery
• DC−DC Converters
MAXIMUM RATINGS (TJ = 25°C unless otherwise stated)
Parameter
Symbol Value Unit
Drain−to−Source Voltage
Gate−to−Source Voltage
Continuous Drain
Current RqJA
(Note 1)
VDSS
30
V
VGS
±20
V
TA = 25°C
ID
12.7
A
TA = 100°C
9.0
Power Dissipation
RqJA (Note 1)
TA = 25°C
PD
Continuous Drain
TA = 25°C
ID
Current RqJA
(Note 2)
Steady TA = 100°C
State
Power Dissipation
TA = 25°C
PD
RqJA (Note 2)
Continuous Drain
Current RqJC
(Note 1)
TC = 25°C
ID
TC = 100°C
2.56 W
9.4
A
6.6
1.38 W
41
A
29
Power Dissipation
RqJC (Note 1)
TC = 25°C
PD
26.3 W
Pulsed Drain
Current
tp=10ms TA = 25°C
IDM
150
A
Current Limited by Package
TA = 25°C
Operating Junction and Storage
Temperature
Source Current (Body Diode)
Drain to Source dV/dt
Single Pulse Drain−to−Source Avalanche
Energy (TJ = 25°C, VDD = 24 V, VGS = 10 V,
IL = 19 Apk, L = 0.1 mH, RG = 25 W)
Lead Temperature for Soldering Purposes
(1/8” from case for 10 s)
IDmaxPkg
TJ,
TSTG
IS
dV/dt
EAS
40
−55 to
+175
24
6.0
18
A
°C
A
V/ns
mJ
TL
260
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface−mounted on FR4 board using 1 sq−in pad, 1 oz Cu.
2. Surface−mounted on FR4 board using the minimum recommended pad size.
http://onsemi.com
V(BR)DSS
30 V
RDS(ON) MAX
9.0 mW @ 10 V
19 mW @ 4.5 V
D
ID MAX
41 A
G
S
N−CHANNEL MOSFET
4
4
4
12
3
CASE 369AA
DPAK
(Bent Lead)
STYLE 2
1 23
1
23
CASE 369AC CASE 369D
3 IPAK
IPAK
(Straight Lead) (Straight Lead
DPAK)
4
Drain
MARKING DIAGRAMS
& PIN ASSIGNMENTS
4
Drain
4
Drain
2
1 Drain 3
Gate Source
1 23
Gate Drain Source
1
23
Gate Drain Source
Y
= Year
WW = Work Week
4969N = Device Code
G
= Pb−Free Package
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 3 of this data sheet.
© Semiconductor Components Industries, LLC, 2011
1
April, 2011 − Rev. 1
Publication Order Number:
NTD4969N/D