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NTD4910N Datasheet, PDF (1/8 Pages) ON Semiconductor – Power MOSFET 30 V, 37 A, Single N−Channel, DPAK/IPAK
NTD4910N
Power MOSFET
30 V, 37 A, Single N−Channel, DPAK/IPAK
Features
• Low RDS(on) to Minimize Conduction Losses
• Low Capacitance to Minimize Driver Losses
• Optimized Gate Charge to Minimize Switching Losses
• These are Pb−Free Devices
Applications
• CPU Power Delivery
• DC−DC Converters
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Parameter
Symbol Value Unit
Drain−to−Source Voltage
Gate−to−Source Voltage
Continuous Drain
Current (RqJA)
(Note 1)
VDSS
30
V
VGS
"20
V
TA = 25°C
ID
11.2
A
TA = 100°C
7.9
Power Dissipation
(RqJA) (Note 1)
Continuous Drain
Current (RqJA)
(Note 2)
Power Dissipation
(RqJA) (Note 2)
Continuous Drain
Current (RqJC)
(Note 1)
TA = 25°C
PD
TA = 25°C
ID
Steady TA = 100°C
State
TA = 25°C
PD
TC = 25°C
ID
TC = 100°C
2.6
W
8.2
A
5.8
1.37 W
37
A
26
Power Dissipation
(RqJC) (Note 1)
TC = 25°C
PD
27.3 W
Pulsed Drain Current tp=10ms TA = 25°C
IDM
152
A
Current Limited by Package
TA = 25°C IDmaxPkg
60
A
Operating Junction and Storage Temperature TJ, Tstg −55 to °C
175
Source Current (Body Diode)
Drain to Source dV/dt
IS
dV/dt
23
A
7.0 V/ns
Single Pulse Drain−to−Source Avalanche
EAS
25.3 mJ
Energy (TJ = 25°C, VDD = 50 V, VGS = 10 V,
L = 0.1 mH, IL(pk) = 22.5 A, RG = 25 W)
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
TL
260
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface−mounted on FR4 board using 1 in sq pad size, 1 oz Cu.
2. Surface−mounted on FR4 board using the minimum recommended pad size.
http://onsemi.com
V(BR)DSS
30 V
RDS(on) MAX
9.0 mW @ 10 V
13 mW @ 4.5 V
D
ID MAX
37 A
N−Channel
G
S
4
4
4
12
3
CASE 369AA
DPAK
(Bent Lead)
STYLE 2
1 23
1
2
3
CASE 369AD CASE 369D
IPAK
IPAK
(Straight Lead) (Straight Lead
DPAK)
4
Drain
MARKING DIAGRAMS
& PIN ASSIGNMENTS
4
Drain
4
Drain
2
1 Drain 3
Gate Source
1 23
Gate Drain Source
1
23
Gate Drain Source
Y
= Year
WW = Work Week
4910N = Device Code
G
= Pb−Free Package
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 3 of this data sheet.
© Semiconductor Components Industries, LLC, 2009
1
June, 2009 − Rev. 0
Publication Order Number:
NTD4910N/D