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NTD4909N Datasheet, PDF (1/8 Pages) ON Semiconductor – Power MOSFET 30 V, 41 A, Single N−Channel, DPAK/IPAK | |||
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NTD4909N
Power MOSFET
30 V, 41 A, Single NâChannel, DPAK/IPAK
Features
⢠Low RDS(on) to Minimize Conduction Losses
⢠Low Capacitance to Minimize Driver Losses
⢠Optimized Gate Charge to Minimize Switching Losses
⢠These are PbâFree Devices
Applications
⢠CPU Power Delivery
⢠DCâDC Converters
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Parameter
Symbol Value Unit
DrainâtoâSource Voltage
GateâtoâSource Voltage
Continuous Drain
Current (RqJA)
(Note 1)
VDSS
30
V
VGS
"20
V
TA = 25°C
ID
12.1
A
TA = 100°C
8.6
Power Dissipation
(RqJA) (Note 1)
Continuous Drain
Current (RqJA)
(Note 2)
Power Dissipation
(RqJA) (Note 2)
Continuous Drain
Current (RqJC)
(Note 1)
TA = 25°C
PD
TA = 25°C
ID
Steady TA = 100°C
State
TA = 25°C
PD
TC = 25°C
ID
TC = 100°C
2.6
W
8.8
A
6.2
1.37 W
41
A
29
Power Dissipation
(RqJC) (Note 1)
TC = 25°C
PD
29.4 W
Pulsed Drain Current tp=10ms TA = 25°C
IDM
167
A
Current Limited by Package
TA = 25°C IDmaxPkg
60
A
Operating Junction and Storage Temperature TJ, Tstg â55 to °C
175
Source Current (Body Diode)
Drain to Source dV/dt
IS
dV/dt
27
A
7.0 V/ns
Single Pulse DrainâtoâSource Avalanche
EAS
Energy (TJ = 25°C, VDD = 50 V, VGS = 10 V,
L = 0.1 mH, IL(pk) = 24 A, RG = 25 W)
28
mJ
Lead Temperature for Soldering Purposes
(1/8â³ from case for 10 s)
TL
260
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surfaceâmounted on FR4 board using 1 in sq pad size, 1 oz Cu.
2. Surfaceâmounted on FR4 board using the minimum recommended pad size.
http://onsemi.com
V(BR)DSS
30 V
RDS(on) MAX
8.0 mW @ 10 V
12 mW @ 4.5 V
D
ID MAX
41 A
NâChannel
G
S
4
4
4
12
3
CASE 369AA
DPAK
(Bent Lead)
STYLE 2
1 23
1
2
3
CASE 369AD CASE 369D
IPAK
IPAK
(Straight Lead) (Straight Lead
DPAK)
4
Drain
MARKING DIAGRAMS
& PIN ASSIGNMENTS
4
Drain
4
Drain
2
1 Drain 3
Gate Source
1 23
Gate Drain Source
1
23
Gate Drain Source
Y
= Year
WW = Work Week
4909N = Device Code
G
= PbâFree Package
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 3 of this data sheet.
© Semiconductor Components Industries, LLC, 2009
1
June, 2009 â Rev. 1
Publication Order Number:
NTD4909N/D
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