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NTD4904N_14 Datasheet, PDF (1/8 Pages) ON Semiconductor – Power MOSFET
NTD4904N
Power MOSFET
30 V, 79 A, Single N−Channel, DPAK/IPAK
Features
• Low RDS(on) to Minimize Conduction Losses
• Low Capacitance to Minimize Driver Losses
• Optimized Gate Charge to Minimize Switching Losses
• These are Pb−Free Devices
Applications
• CPU Power Delivery
• DC−DC Converters
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Parameter
Symbol Value Unit
Drain−to−Source Voltage
Gate−to−Source Voltage
Continuous Drain
Current (RqJA)
(Note 1)
VDSS
30
V
VGS
"20
V
TA = 25°C
ID
17.8
A
TA = 100°C
12.6
Power Dissipation
(RqJA) (Note 1)
TA = 25°C
PD
Continuous Drain
TA = 25°C
ID
Current (RqJA) (Note
2)
Steady TA = 100°C
State
Power Dissipation
TA = 25°C
PD
(RqJA) (Note 2)
Continuous Drain
Current (RqJC)
(Note 1)
TC = 25°C
ID
TC = 100°C
2.6
W
13
A
9.2
1.4
W
79
A
56
Power Dissipation
(RqJC) (Note 1)
TC = 25°C
PD
52
W
Pulsed Drain Current tp=10ms TA = 25°C
IDM
316
A
Current Limited by Package
TA = 25°C IDmaxPkg
90
A
Operating Junction and Storage Temperature TJ, Tstg −55 to °C
175
Source Current (Body Diode)
Drain to Source dV/dt
IS
dV/dt
47
A
6.0 V/ns
Single Pulse Drain−to−Source Avalanche
EAS
68.4 mJ
Energy (TJ = 25°C, VDD = 50 V, VGS = 10 V,
L = 0.1 mH, IL(pk) = 37 A, RG = 25 W)
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
TL
260
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
http://onsemi.com
V(BR)DSS
30 V
RDS(on) MAX
3.7 mW @ 10 V
5.5 mW @ 4.5 V
D
ID MAX
79 A
N−Channel
G
S
4
4
4
12
3
CASE 369AA
DPAK
(Bent Lead)
STYLE 2
1 23
1
2
3
CASE 369AD CASE 369D
IPAK
IPAK
(Straight Lead) (Straight Lead
DPAK)
4
Drain
MARKING DIAGRAMS
& PIN ASSIGNMENTS
4
Drain
4
Drain
2
1 Drain 3
Gate Source
1 23
Gate Drain Source
1
23
Gate Drain Source
A
= Assembly Location
Y
= Year
WW = Work Week
4904N = Device Code
G
= Pb−Free Package
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 6 of this data sheet.
© Semiconductor Components Industries, LLC, 2014
1
June, 2014 − Rev. 2
Publication Order Number:
NTD4904N/D