NTD4810N_11 Datasheet, PDF (1/7 Pages) ON Semiconductor – Power MOSFET

NTD4810N, NVD4810N
Power MOSFET
30 V, 54 A, Single N−Channel, DPAK/IPAK
Features
• Low R_DS(on) to Minimize Conduction Losses
• Low Capacitance to Minimize Driver Losses
• Optimized Gate Charge to Minimize Switching Losses
• AEC−Q101 Qualified and PPAP Capable − NVD4810N
• These Devices are Pb−Free and are RoHS Compliant
Applications
• CPU Power Delivery
• DC−DC Converters
MAXIMUM RATINGS (T_J = 25°C unless otherwise noted)
Parameter
Symbol Value Unit
Drain−to−Source Voltage
V_DSS
30
V
Gate−to−Source Voltage
V_GS
"20
V
Continuous Drain
Current (R_qJA) (Note 1)
T_A = 25°C
I_D
T_A = 85°C
12.4
A
9.6
Power Dissipation
(R_qJA) (Note 1)
T_A = 25°C
P_D
2.62
W
Continuous Drain
T_A = 25°C
I_D
Current (R_qJA) (Note 2) _{Steady TA = 85°C}
Power Dissipation
(R_qJA) (Note 2)
State _{TA = 25°C}
P_D
9
A
7
1.4
W
Continuous Drain
Current (R_qJC)
(Note 1)
T_C = 25°C
I_D
T_C = 85°C
54
A
42
Power Dissipation
(R_qJC) (Note 1)
T_C = 25°C
P_D
50
W
Pulsed Drain Current t_p=10ms T_A = 25°C I_DM
120
A
Current Limited by Package
T_A = 25°C I_DmaxPkg
45
A
Operating Junction and Storage Temperature T_J, T_stg −55 to °C
175
Source Current (Body Diode)
Drain to Source dV/dt
I_S
dV/dt
41
A
6.0 V/ns
Single Pulse Drain−to−Source Avalanche
Energy (V_DD = 24 V, V_GS = 10 V,
L = 1.0 mH, I_L(pk) = 14 A, R_G = 25 W)
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
E_AS
98
mJ
T_L
260
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
http://onsemi.com
V_(BR)DSS
30 V
R_DS(on) MAX
10 mW @ 10 V
15.7 mW @ 4.5 V
D
I_D MAX
54 A
N−Channel
G
S
4
12
3
CASE 369AA
DPAK
(Bent Lead)
STYLE 2
MARKING DIAGRAM
& PIN ASSIGNMENT
4
Drain
2
1 ^Drain 3
Gate Source
Y
= Year
WW = Work Week
4810N = Device Code
G
= Pb−Free Package
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 6 of this data sheet.
© Semiconductor Components Industries, LLC, 2011
1
October, 2011 − Rev. 10
Publication Order Number:
NTD4810N/D