NTD32N06L Datasheet, PDF (1/8 Pages) ON Semiconductor – Power MOSFET 32 Amps, 60 Volts, Logic Level(N-Channel DPAK)

NTD32N06L
Power MOSFET
32 Amps, 60 Volts, Logic Level
N−Channel DPAK
Designed for low voltage, high speed switching applications in
power supplies, converters and power motor controls and bridge
circuits.
Features
• Smaller Package than MTB30N06VL
• Lower R_DS(on), V_DS(on), and Total Gate Charge
• Lower and Tighter V_SD
• Lower Diode Reverse Recovery Time
• Lower Reverse Recovery Stored Charge
http://onsemi.com
V_DSS
60 V
R_DS(ON) TYP
23.7 mW
N−Channel
D
I_D MAX
32 A
Typical Applications
• Power Supplies
• Converters
• Power Motor Controls
• Bridge Circuits
MAXIMUM RATINGS (T_J = 25°C unless otherwise noted)
Rating
Symbol Value Unit
Drain−to−Source Voltage
Drain−to−Gate Voltage (R_GS = 10 MW)
Gate−to−Source Voltage
− Continuous
− Non−Repetitive (t_pv10 ms)
Drain Current
− Continuous @ T_A = 25°C
− Continuous @ T_A = 100°C
− Single Pulse (t_pv10 ms)
Total Power Dissipation @ T_A = 25°C
Derate above 25°C
Total Power Dissipation @ T_A = 25°C (Note 1)
Total Power Dissipation @ T_A = 25°C (Note 2)
Operating and Storage Temperature Range
V_DSS
V_DGR
V_GS
V_GS
60 Vdc
60 Vdc
Vdc
"20
"30
I_D
I_D
I_DM
P_D
T_J, T_stg
32 Adc
22
90 Apk
93.75
0.625
2.88
1.5
W
W/°C
W
W
−55 to °C
+175
Single Pulse Drain−to−Source Avalanche
Energy − Starting T_J = 25°C (Note 3)
(V_DD = 50 Vdc, V_GS = 5 Vdc, L = 1.0 mH,
I_L(pk) = 25 A, V_DS = 60 Vdc, R_G = 25 W)
Thermal Resistance
− Junction−to−Case
− Junction−to−Ambient (Note 1)
− Junction−to−Ambient (Note 2)
Maximum Lead Temperature for Soldering
Purposes, 1/8″ from case for 10 seconds
E_AS
313 mJ
R_qJC
R_qJA
R_qJA
T_L
°C/W
1.6
52
100
260 °C
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits
are exceeded, device functional operation is not implied, damage may occur
and reliability may be affected.
1. When surface mounted to FR4 board using 0.5″ pad size.
2. When surface mounted to FR4 board using minimum recommended pad
size.
3. Repetitive rating; pulse width limited by maximum junction temperature.
G
4
12
3
DPAK
CASE 369C
(Surface Mount)
Style 2
4
S
MARKING DIAGRAMS
4
Drain
1
Gate
2
Drain
3
Source
4
Drain
1
2
3
DPAK
CASE 369D
(Straight Lead)
Style 2
32N06L
Y
WW
Device Code
= Year
= Work Week
12 3
Gate Drain Source
ORDERING INFORMATION
Device
Package
Shipping^†
NTD32N06L
DPAK
75 Units/Rail
DPAK
NTD32N06L−1 _{Straight Lead}
75 Units/Rail
NTD32N06LT4
DPAK
2500/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2004
1
April, 2004 − Rev. 3
Publication Order Number:
NTD32N06L/D