NTD3055-150 Datasheet, PDF (1/8 Pages) ON Semiconductor – Power MOSFET 9.0 A, 60 V

NTD3055−150
Power MOSFET 9.0 A, 60 V
N−Channel DPAK
Designed for low voltage, high speed switching applications in
power supplies, converters and power motor controls and bridge
circuits.
Features
• Pb−Free Packages are Available
Typical Applications
• Power Supplies
• Converters
• Power Motor Controls
• Bridge Circuits
MAXIMUM RATINGS (T_J = 25°C unless otherwise noted)
Rating
Symbol Value
Drain−to−Source Voltage
Drain−to−Gate Voltage (R_GS = 10 MW)
Gate−to−Source Voltage
− Continuous
− Non−repetitive (t_pv10 ms)
Drain Current
− Continuous @ T_A = 25°C
− Continuous @ T_A = 100°C
− Single Pulse (t_pv10 ms)
Total Power Dissipation @ T_A = 25°C
Derate above 25°C
Total Power Dissipation @ T_A = 25°C (Note 1)
Total Power Dissipation @ T_A = 25°C (Note 2)
Operating and Storage Temperature Range
V_DSS
V_DGR
V_GS
V_GS
I_D
I_D
I_DM
P_D
T_J, T_stg
60
60
"20
"30
9.0
3.0
27
28.8
0.19
2.1
1.5
−55 to
175
Single Pulse Drain−to−Source Avalanche
E_AS
30
Energy − Starting T_J = 25°C
(V_DD = 25 Vdc, V_GS = 10 Vdc,
L = 1.0 mH, I_L(pk) = 7.75 A, V_DS = 60 Vdc)
Thermal Resistance
− Junction−to−Case
− Junction−to−Ambient (Note 1)
− Junction−to−Ambient (Note 2)
R_qJC
R_qJA
R_qJA
5.2
71.4
100
Unit
Vdc
Vdc
Vdc
Adc
Apk
W
W/°C
W
W
°C
mJ
°C/W
Maximum Lead Temperature for Soldering
Purposes, 1/8″ from case for 10 seconds
T_L
260 °C
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits
are exceeded, device functional operation is not implied, damage may occur
and reliability may be affected.
1. When surface mounted to an FR4 board using 0.5 sq in pad size.
2. When surface mounted to an FR4 board using minimum recommended
pad size.
http://onsemi.com
9.0 AMPERES, 60 VOLTS
R_DS(on) = 122 mW (Typ)
N−Channel
D
G
S
12
3
1
2
3
MARKING
DIAGRAMS
4
Drain
4
DPAK
CASE 369C
STYLE 2
“SURFACE MOUNT”
1
Gate
2
Drain
3
Source
4
DPAK−3
CASE 369D
STYLE 2
“STRAIGHT LEAD”
4
Drain
12 3
Gate Drain Source
3150
A
Y
W
Device Code
= Assembly Location
= Year
= Work Week
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
© Semiconductor Components Industries, LLC, 2004
1
August, 2004 − Rev. 4
Publication Order Number:
NTD3055−150/D