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NTD3055-094 Datasheet, PDF (1/10 Pages) ON Semiconductor – Power MOSFET 12 A, 60 V | |||
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NTD3055â094
Power MOSFET 12 A, 60 V
NâChannel DPAK
Designed for low voltage, high speed switching applications in
power supplies, converters and power motor controls and bridge
circuits.
Features
⢠PbâFree Packages are Available
⢠Lower RDS(on)
⢠Lower VDS(on)
⢠Lower and Tighter VSD
⢠Lower Diode Reverse Recovery Time
⢠Lower Reverse Recovery Stored Charge
Typical Applications
⢠Power Supplies
⢠Converters
⢠Power Motor Controls
⢠Bridge Circuits
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Rating
Symbol Value Unit
DrainâtoâSource Voltage
DrainâtoâGate Voltage (RGS = 10 MW)
GateâtoâSource Voltage
â Continuous
â NonâRepetitive (tpv10 ms)
Drain Current
â Continuous @ TA = 25°C
â Continuous @ TA = 100°C
â Single Pulse (tpv10 ms)
Total Power Dissipation @ TA = 25°C
Derate above 25°C
Total Power Dissipation @ TA = 25°C (Note 1)
Total Power Dissipation @ TA = 25°C (Note 2)
Operating and Storage Temperature Range
VDSS
VDGR
VGS
VGS
ID
ID
IDM
PD
TJ, Tstg
60 Vdc
60 Vdc
Vdc
"20
"30
12
10
45
48
0.32
2.1
1.5
â55 to
+175
Adc
Apk
W
W/°C
W
W
°C
Single Pulse DrainâtoâSource Avalanche
Energy â Starting TJ = 25°C
(VDD = 25 Vdc, VGS = 10 Vdc, L = 1.0 mH
IL(pk) = 11 A, VDS = 60 Vdc)
Thermal Resistance
â JunctionâtoâCase
â JunctionâtoâAmbient (Note 1)
â JunctionâtoâAmbient (Note 2)
Maximum Lead Temperature for Soldering
Purposes, 1/8â³ from case for 10 seconds
EAS
RqJC
RqJA
RqJA
TL
61
mJ
3.13 °C/W
71.4
100
260 °C
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits
are exceeded, device functional operation is not implied, damage may occur
and reliability may be affected.
1. When surface mounted to an FR4 board using 0.5 sq in. pad size.
2. When surface mounted to an FR4 board using the minimum recommended
pad size.
http://onsemi.com
V(BR)DSS
60 V
RDS(on) TYP
94 mW
ID MAX
12 A
NâChannel
D
G
S
MARKING
DIAGRAMS
4
12
3
4
4
Drain
DPAK
CASE 369C
STYLE 2
1
Gate
2
Drain
3
Source
4
Drain
DPAKâ3
CASE 369D
STYLE 2
1
2
3
12 3
Gate Drain Source
55094
A
Y
W
Device Code
= Assembly Location
= Year
= Work Week
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 7 of this data sheet.
© Semiconductor Components Industries, LLC, 2004
1
August, 2004 â Rev. 6
Publication Order Number:
NTD3055â094/D
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