NTD25P03L_06 Datasheet, PDF (1/9 Pages) ON Semiconductor – Power MOSFET -25 Amp, -30 Volt

NTD25P03L
Power MOSFET
−25 Amp, −30 Volt
Logic Level P−Channel DPAK
Designed for low voltage, high speed switching applications and to
withstand high energy in the avalanche and commutation modes. The
source−to−drain diode recovery time is comparable to a discrete fast
recovery diode.
Features
• Pb−Free Packages are Available
Typical Applications
• PWM Motor Controls
• Power Supplies
• Converters
• Bridge Circuits
MAXIMUM RATINGS (T_J = 25°C unless otherwise noted)
Rating
Symbol Value Unit
Drain−to−Source Voltage
V_DSS
−30
V
Gate−to−Source Voltage
− Continuous
− Non−Repetitive (tp ≤ 10 ms)
V_GS
"15
V
V_GSM
"20
Vpk
Drain Current
− Continuous @ T_A = 25°C
− Single Pulse (t_p ≤ 10 ms)
I_D
−25
A
I_DM
−75
Apk
Total Power Dissipation @ T_A = 25°C
P_D
75
W
Operating and Storage Temperature Range T_J, T_stg −55 to
°C
+150
Single Pulse Drain−to−Source Avalanche
E_AS
200
mJ
Energy − Starting T_J = 25°C
(V_DD = 25 Vdc, V_GS = 5.0 Vdc,
Peak I_L = 20 Apk, L = 1.0 mH, R_G = 25 W)
Thermal Resistance
− Junction−to−Case
− Junction−to−Ambient (Note 1)
− Junction−to−Ambient (Note 2)
R_qJC
R_qJA
R_qJA
°C/W
1.65
67
120
Maximum Lead Temperature for Soldering
T_L
Purposes, (1/8 in from case for 10 seconds)
260
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. When surface mounted to an FR4 board using 0.5 sq in pad size.
2. When surface mounted to an FR4 board using the minimum recommended
pad size.
http://onsemi.com
V_(BR)DSS
−30 V
R_DS(on) Typ
51 mW @ 5.0 V
I_D Max
−25 A
P−Channel
D
G
S
4
12
3
MARKING DIAGRAMS
& PIN ASSIGNMENTS
4
Drain
DPAK
CASE 369C
STYLE 2
1
Gate
2
Drain
3
Source
4
1
2
3
DPAK−3
CASE 369D
STYLE 2
4
Drain
12 3
Gate Drain Source
Y
WW
25P03L
G
= Year
= Work Week
= Device Code
= Pb−Free Package
© Semiconductor Components Industries, LLC, 2006
March, 2006 − Rev. 3
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 7 of this data sheet.
1
Publication Order Number:
NTD25P03L/D