NTD24N06_14 Datasheet, PDF (1/8 Pages) ON Semiconductor – Power MOSFET

NTD24N06
Power MOSFET
60 V, 24 A, N−Channel DPAK/IPAK
Designed for low voltage, high speed switching applications in
power supplies, converters and power motor controls and bridge
circuits.
Features
• Pb−Free Packages are Available
Typical Applications
• Power Supplies
• Converters
• Power Motor Controls
• Bridge Circuits
MAXIMUM RATINGS (T_J = 25°C unless otherwise noted)
Rating
Symbol Value Unit
Drain−to−Source Voltage
Drain−to−Gate Voltage (R_GS = 10 MW)
Gate−to−Source Voltage
− Continuous
− Non−repetitive (t_pv10 ms)
Drain Current
− Continuous @ T_A = 25°C, T_J = 150°C
− Continuous @ T_A = 25°C, T_J = 175°C
− Continuous @ T_A = 100°C, T_J = 175°C
− Single Pulse (t_pv10 ms), T_J = 175°C
Total Power Dissipation @ T_A = 25°C
Derate above 25°C
Total Power Dissipation @ T_A = 25°C (Note 1)
Total Power Dissipation @ T_A = 25°C (Note 2)
Operating and Storage Temperature Range
V_DSS
V_DGR
V_GS
V_GS
I_D
I_D
I_D
I_DM
P_D
T_J, T_stg
60
60
±20
±30
24
27
19
80
62.5
0.42
1.88
1.36
−55 to
+175
Vdc
Vdc
Vdc
Adc
Adc
Adc
Apk
W
W/°C
W
W
°C
Single Pulse Drain−to−Source Avalanche
Energy − Starting T_J = 25°C
(V_DD = 50 Vdc, V_GS = 10 Vdc,
L = 1.0 mH, I_L(pk) = 18 A, V_DS = 60 Vdc)
E_AS
162
mJ
Thermal Resistance
− Junction−to−Case
− Junction−to−Ambient (Note 1)
− Junction−to−Ambient (Note 2)
R_qJC
R_qJA
R_qJA
°C/W
2.4
80
110
Maximum Lead Temperature for Soldering
Purposes, 1/8 in from case for 10 seconds
T_L
260
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. When surface mounted to an FR−4 board using the 0.5 sq in drain pad size.
2. When surface mounted to an FR−4 board using the minimum recommended
pad size.
© Semiconductor Components Industries, LLC, 2014
1
September, 2014 − Rev. 5
http://onsemi.com
V_(BR)DSS
60 V
R_DS(on) TYP
32 mW
D
I_D MAX
24 A
N−Channel
G
S
4
4
12
3
DPAK
CASE 369C
(Surface Mount)
STYLE 2
1
2
3
IPAK
CASE 369D
(Straight Lead)
STYLE 2
MARKING DIAGRAMS
& PIN ASSIGNMENTS
4
Drain
4
Drain
1
Gate
2
Drain
3
Source
12 3
Gate Drain Source
A
Y
WW
24N06
G
= Assembly Location*
= Year
= Work Week
= Device Code
= Pb−Free Package
* The Assembly Location code (A) is front side
optional. In cases where the Assembly Location is
stamped in the package, the front side assembly
code may be blank.
ORDERING INFORMATION
See detailed ordering and shipping information on page 2 of
this data sheet.
Publication Order Number:
NTD24N06/D