NTD23N03R Datasheet, PDF (1/8 Pages) ON Semiconductor – 23 Amps, 25 Volts, N-Channel DPAK

NTD23N03R
Power MOSFET
23 Amps, 25 Volts, N−Channel DPAK
Features
• Pb−Free Packages are Available
• Planar HD3e Process for Fast Switching Performance
• Low R_DS(on) to Minimize Conduction Loss
• Low C_iss to Minimize Driver Loss
• Low Gate Charge
• Optimized for High Side Switching Requirements in
High−Efficiency DC−DC Converters
http://onsemi.com
V_(BR)DSS
25 V
R_DS(on) TYP
32 mW
I_D MAX
23 A
N−CHANNEL
D
MAXIMUM RATINGS (T_J = 25°C unless otherwise specified)
Parameter
Symbol Value Unit
Drain−to−Source Voltage
Gate−to−Source Voltage − Continuous
Thermal Resistance, Junction−to−Case
Total Power Dissipation @ T_C = 25°C
Drain Current
− Continuous @ T_C = 25°C, Chip
− Continuous @ T_C = 25°C,
Limited by Package
− Single Pulse
Thermal Resistance, Junction−to−Ambient
(Note 1)
Total Power Dissipation @ T_A = 25°C
Drain Current − Continuous @ T_A = 25°C
Thermal Resistance, Junction−to−Ambient
(Note 2)
Total Power Dissipation @ T_A = 25°C
Drain Current − Continuous @ T_A = 25°C
Operating and Storage Temperature Range
V_DSS
V_GS
R_qJC
P_D
I_D
I_D
I_DM
R_qJA
P_D
I_D
R_qJA
P_D
I_D
T_J, T_stg
25 Vdc
±20 Vdc
5.6 °C/W
22.3 W
23
A
17.1
A
40
A
76 °C/W
1.64 W
4.5
A
110 °C/W
1.14 W
3.8
A
−55 to °C
150
Maximum Lead Temperature for Soldering
Purposes, 1/8″ from case for 10 seconds
T_L
260 °C
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits
are exceeded, device functional operation is not implied, damage may occur
and reliability may be affected.
1. When surface mounted to an FR4 board using 0.5 sq in pad size.
2. When surface mounted to an FR4 board using minimum recommended pad
size.
G
S
12
3
MARKING
DIAGRAMS
4
DPAK
CASE 369AA
(Surface Mounted)
STYLE 2
4
Drain
1
Gate
2
Drain
3
Source
4
1
2
3
DPAK−3
CASE 369D
(Straight Lead)
STYLE 2
4
Drain
12 3
Gate Drain Source
T23N03
A
Y
WW
= Device Code
= Assembly Location
= Year
= Work Week
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 5 of this data sheet.
© Semiconductor Components Industries, LLC, 2004
1
August, 2004 − Rev. 4
Publication Order Number:
NTD23N03R/D