NTD18N06L-001 Datasheet, PDF (1/9 Pages) ON Semiconductor – Power MOSFET 18 Amps, 60 Volts

NTD18N06
Power MOSFET
18 Amps, 60 Volts
N−Channel DPAK
Designed for low voltage, high speed switching applications in
power supplies, converters and power motor controls and bridge
circuits.
Features
• Pb−Free Packages are Available
Typical Applications
• Power Supplies
• Converters
• Power Motor Controls
• Bridge Circuits
MAXIMUM RATINGS (T_J = 25°C unless otherwise noted)
Rating
Symbol Value
Drain−to−Source Voltage
Drain−to−Gate Voltage (R_GS = 10 MW)
Gate−to−Source Voltage
− Continuous
− Non−repetitive (t_pv10 ms)
Drain Current
− Continuous @ T_A = 25°C
− Continuous @ T_A = 100°C
− Single Pulse (t_pv10 ms)
Total Power Dissipation @ T_A = 25°C
Derate above 25°C
Total Power Dissipation @ T_A = 25°C (Note 2)
Operating and Storage Temperature Range
V_DSS
V_DGR
V_GS
V_GS
I_D
I_D
I_DM
P_D
T_J, T_stg
60
60
"20
"30
18
10
54
55
0.36
2.1
−55 to
+175
Single Pulse Drain−to−Source Avalanche
Energy − Starting T_J = 25°C
(V_DD = 50 Vdc, V_GS = 5.0 Vdc,
L = 1.0 mH, I_L(pk) = 12 A, V_DS = 60 Vdc)
Thermal Resistance
− Junction−to−Case
− Junction−to−Ambient (Note 1)
− Junction−to−Ambient (Note 2)
E_AS
72
R_qJC
R_qJA
R_qJA
2.73
100
71.4
Maximum Lead Temperature for Soldering
Purposes, 1/8″ from case for 10 seconds
T_L
260
Unit
Vdc
Vdc
Vdc
Adc
Apk
W
W/°C
W
°C
mJ
°C/W
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recom-
mended Operating Conditions is not implied. Extended exposure to stresses
above the Recommended Operating Conditions may affect device reliability.
1. When surface mounted to an FR−4 board using the minimum recommended
pad size.
2. When surface mounted to an FR−4 board using the 0.5 sq in drain pad size.
http://onsemi.com
V_(BR)DSS
60 V
R_DS(on) TYP
51 mW
I_D MAX
18 A
N−Channel
D
G
S
12
3
4
DPAK
CASE 369C
STYLE 2
MARKING
DIAGRAMS
4
Drain
1
Gate
2
Drain
3
Source
4
DPAK−3
CASE 369D
STYLE 2
4
Drain
1
2
3
12 3
Gate Drain Source
18N06
Y
WW
G
= Device Code
= Year
= Work Week
= Pb−Free Device
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 7 of this data sheet.
© Semiconductor Components Industries, LLC, 2006
1
March, 2006 − Rev. 2
Publication Order Number:
NTD18N06/D