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NTD18N06 Datasheet, PDF (1/8 Pages) ON Semiconductor – Power MOSFET | |||
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NTD18N06L
Power MOSFET
18 Amps, 60 Volts, Logic Level
NâChannel DPAK
Designed for low voltage, high speed switching applications in
power supplies, converters and power motor controls and bridge
circuits.
Features
⢠PbâFree Packages are Available
Typical Applications
⢠Power Supplies
⢠Converters
⢠Power Motor Controls
⢠Bridge Circuits
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Rating
Symbol Value
DrainâtoâSource Voltage
DrainâtoâGate Voltage (RGS = 10 MW)
GateâtoâSource Voltage
â Continuous
â Nonârepetitive (tpv10 ms)
Drain Current
â Continuous @ TA = 25°C
â Continuous @ TA = 100°C
â Single Pulse (tpv10 ms)
Total Power Dissipation @ TA = 25°C
Derate above 25°C
Total Power Dissipation @ TA = 25°C (Note 2)
Operating and Storage Temperature Range
VDSS
VDGR
VGS
VGS
ID
ID
IDM
PD
TJ, Tstg
60
60
"15
"20
18
10
54
55
0.36
2.1
â55 to
+175
Single Pulse DrainâtoâSource Avalanche
Energy â Starting TJ = 25°C
(VDD = 50 Vdc, VGS = 5.0 Vdc,
L = 1.0 mH, IL(pk) = 12 A, VDS = 60 Vdc)
Thermal Resistance
â JunctionâtoâCase
â JunctionâtoâAmbient (Note 1)
â JunctionâtoâAmbient (Note 2)
EAS
72
RqJC
RqJA
RqJA
2.73
100
71.4
Maximum Lead Temperature for Soldering
Purposes, 1/8â³ from case for 10 seconds
TL
260
Unit
Vdc
Vdc
Vdc
Adc
Apk
W
W/°C
W
°C
mJ
°C/W
°C
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits
are exceeded, device functional operation is not implied, damage may occur
and reliability may be affected.
1. When surface mounted to an FRâ4 board using the minimum recommended
pad size.
2. When surface mounted to an FRâ4 board using the 0.5 sq in drain pad size.
http://onsemi.com
V(BR)DSS
60 V
RDS(on) TYP
54 mW@5.0 V
ID MAX
18 A
(Note 1)
NâChannel
D
G
S
12
3
4
DPAK
CASE 369C
STYLE 2
MARKING
DIAGRAMS
4
Drain
1
Gate
2
Drain
3
Source
4
DPAKâ3
CASE 369D
STYLE 2
4
Drain
1
2
3
18N6L
A
Y
WW
12 3
Gate Drain Source
Device Code
= Assembly Location
= Year
= Work Week
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
© Semiconductor Components Industries, LLC, 2004
1
August, 2004 â Rev. 3
Publication Order Number:
NTD18N06L/D
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