NTD12N10-1G Datasheet, PDF (1/8 Pages) ON Semiconductor – Power MOSFET 12 Amps, 100 Volts

NTD12N10
Power MOSFET
12 Amps, 100 Volts
N−Channel Enhancement−Mode DPAK
Features
• Source−to−Drain Diode Recovery Time Comparable to a Discrete
Fast Recovery Diode
• Avalanche Energy Specified
• I_DSS and R_DS(on) Specified at Elevated Temperature
• Mounting Information Provided for the DPAK Package
• These are Pb−Free Devices
Typical Applications
• PWM Motor Controls
• Power Supplies
• Converters
MAXIMUM RATINGS (T_C = 25°C unless otherwise noted)
Rating
Symbol Value Unit
Drain−to−Source Voltage
Drain−to−Source Voltage (R_GS = 1.0 MW)
Gate−to−Source Voltage
− Continuous
− Non−Repetitive (t_p ≤ 10 ms)
Drain Current − Continuous @ T_A = 25°C
− Continuous @ T_A =100°C
− Pulsed (Note 3)
Total Power Dissipation
Derate above 25°C
Total Power Dissipation @ T_A = 25°C (Note 1)
Total Power Dissipation @ T_A = 25°C (Note 2)
Operating and Storage Temperature Range
V_DSS
V_DGR
V_GS
V_GSM
I_D
I_D
I_DM
P_D
T_J, T_stg
100
100
± 20
± 30
12
7.0
36
56.6
0.38
1.76
1.28
−55 to
+175
Vdc
Vdc
Vdc
Vpk
Adc
Apk
W
W/°C
W
W
°C
Single Pulse Drain−to−Source Avalanche
Energy − Starting T_J = 25°C
(V_DD = 50 Vdc, V_GS = 10 Vdc,
I_L = 12 Apk, L = 1.0 mH, R_G = 25 W)
E_AS
75
mJ
Thermal Resistance
− Junction to Case
− Junction to Ambient (Note 1)
− Junction to Ambient (Note 2)
R_qJC
R_qJA
R_qJA
°C/W
2.65
85
117
Maximum Temperature for Soldering
Purposes, 1/8 in from case for 10 seconds
T_L
260
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. When surface mounted to an FR4 board using 0.5 sq in pad size.
2. When surface mounted to an FR4 board using the minimum recommended
pad size.
3. Pulse Test: Pulse Width = 10 ms, Duty Cycle = 2%.
http://onsemi.com
V_(BR)DSS
100 V
R_DS(on) TYP
165 mW @ 10 V
I_D MAX
12 A
N−Channel
D
G
S
12
3
MARKING DIAGRAMS
& PIN ASSIGNMENTS
4
Drain
4
DPAK
CASE 369C
(Surface Mount)
STYLE 2
1
Gate
2
Drain
3
Source
4
1
2
3
DPAK
CASE 369D
(Straight Lead)
STYLE 2
4
Drain
Y
WW
T12N10
G
12 3
Gate Drain Source
= Year
= Work Week
= Device Code
= Pb−Free Package
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
© Semiconductor Components Industries, LLC, 2010
1
May, 2010 − Rev. 8
Publication Order Number:
NTD12N10/D