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NTD110N02R_14 Datasheet, PDF (1/6 Pages) ON Semiconductor – Power MOSFET | |||
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NTD110N02R, STD110N02R
Power MOSFET
24 V, 110 A, NâChannel DPAK
Features
⢠Planar HD3e Process for Fast Switching Performance
⢠Low RDS(on) to Minimize Conduction Loss
⢠Low Ciss to Minimize Driver Loss
⢠Low Gate Charge
⢠Optimized for High Side Switching Requirements in
HighâEfficiency DCâDC Converters
⢠S Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AECâQ101 Qualified and
PPAP Capable
⢠These Devices are PbâFree and are RoHS Compliant
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Rating
Symbol Value Unit
DrainâtoâSource Voltage
GateâtoâSource Voltage â Continuous
Thermal Resistance â JunctionâtoâCase
Total Power Dissipation @ TC = 25°C
Drain Current
â Continuous @ TC = 25°C, Chip
â Continuous @ TC = 25°C
Limited by Package
â Continuous @ TA = 25°C
Limited by Wires
â Single Pulse (tp = 10 ms)
Thermal Resistance
â JunctionâtoâAmbient (Note 1)
â Total Power Dissipation @ TA = 25°C
â Drain Current â Continuous @ TA = 25°C
Thermal Resistance
â JunctionâtoâAmbient (Note 2)
â Total Power Dissipation @ TA = 25°C
â Drain Current â Continuous @ TA = 25°C
Operating and Storage Temperature Range
VDSS
VGS
RqJC
PD
ID
ID
ID
ID
RqJA
PD
ID
RqJA
PD
ID
TJ, Tstg
24
±20
1.35
110
110
110
32
110
52
2.88
17.5
100
1.5
12.5
â55 to
175
V
V
°C/W
W
A
A
A
A
°C/W
W
A
°C/W
W
A
°C
Single Pulse DrainâtoâSource Avalanche
Energy â Starting TJ = 25°C
(VDD = 50 Vdc, VGS = 10 Vdc,
IL = 15.5 Apk, L = 1.0 mH, RG = 25 W)
EAS
120
mJ
Maximum Lead Temperature for Soldering
Purposes, (1/8â³ from case for 10 s)
TL
260
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. When surface mounted to an FR4 board using 0.5 sq in drain pad size.
2. When surface mounted to an FR4 board using the minimum recommended
pad size.
http://onsemi.com
V(BR)DSS
24 V
RDS(on) TYP
4.1 mW @ 10 V
ID MAX
110 A
D
NâChannel
G
S
4
12
3
DPAK
CASE 369AA
(Surface Mount)
STYLE 2
MARKING DIAGRAM
& PIN ASSIGNMENT
4
Drain
1
Gate
2
Drain
3
Source
A
Y
WW
T110N2
G
= Assembly Location*
= Year
= Work Week
= Device Code
= PbâFree Package
* The Assembly Location code (A) is front side
optional. In cases where the Assembly Location is
stamped in the package, the front side assembly
code may be blank.
ORDERING INFORMATION
See detailed ordering and shipping information on page 5 of
this data sheet.
© Semiconductor Components Industries, LLC, 2014
1
September, 2014 â Rev. 11
Publication Order Number:
NTD110N02R/D
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