NTBV5605T4G Datasheet, PDF (1/7 Pages) ON Semiconductor – Power MOSFET -60 V, -18.5 A

NTB5605P, NTBV5605
Power MOSFET
-60 V, -18.5 A
P−Channel, D²PAK
Features
• Designed for Low R_DS(on)
• Withstands High Energy in Avalanche and Commutation Modes
• AEC Q101 Qualified − NTBV5605
• These Devices are Pb−Free and are RoHS Compliant
Applications
• Power Supplies
• PWM Motor Control
• Converters
• Power Management
MAXIMUM RATINGS (T_J = 25°C unless otherwise noted)
Parameter
Symbol Value Unit
Drain−to−Source Voltage
V_DSS
−60
V
Gate−to−Source Voltage
V_GS
$20
V
Continuous Drain
Current (Note 1)
Steady T_A = 25°C
I_D
State
−18.5 A
Power Dissipation
(Note 1)
Steady T_A = 25°C
P_D
State
88
W
Pulsed Drain Current
t_p = 10 ms
Operating Junction and Storage Temperature
Single Pulse Drain−to−Source Avalanche
Energy (V_DD = 25 V, V_GS = 5.0 V, I_PK = 15 A,
L = 3.0 mH, R_G = 25 W)
Lead Temperature for Soldering Purposes
(1/8 in from case for 10 s)
I_DM
−55
A
T_J,
−55 to °C
T_STG
175
E_AS
338
mJ
T_L
260
°C
THERMAL RESISTANCE RATINGS
Parameter
Symbol Max Unit
Junction−to−Case (Drain) – Steady State
R_qJC
1.7 °C/W
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. When surface mounted to an FR4 board using 1″ pad size (Cu Area 1.127 in²).
2. When surface mounted to an FR4 board using the minimum recommended
pad size (Cu Area 0.41 in²).
http://onsemi.com
V_(BR)DSS
−60 V
R_DS(on) TYP
120 mW @ −5.0 V
I_D MAX
−18.5 A
P−Channel
D
G
S
MARKING DIAGRAM
& PIN ASSIGNMENT
4
Drain
4
2
1
3
D²PAK
CASE 418B
STYLE 2
NTB5605xG
AYWW
1 23
Gate Drain Source
x
= P or blank
A
= Assembly Location
Y
= Year
WW
= Work Week
G
= Pb−Free Package
ORDERING INFORMATION
Device
Package
Shipping^†
NTB5605PT4G
D²PAK 800 / Tape & Reel
(Pb−Free)
NTBV5605T4G
D²PAK 800 / Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2011
1
August, 2011 − Rev. 4
Publication Order Number:
NTB5605P/D