NTB90N02_05 Datasheet, PDF (1/8 Pages) ON Semiconductor – Power MOSFET 90 Amps, 24 Volts

NTB90N02, NTP90N02
Power MOSFET
90 Amps, 24 Volts
N−Channel D²PAK and TO−220
Designed for low voltage, high speed switching applications in
power supplies, converters and power motor controls and bridge
circuits.
Features
• Pb−Free Packages are Available
Typical Applications
• Power Supplies
• Converters
• Power Motor Controls
• Bridge Circuits
http://onsemi.com
V_(BR)DSS
24 V
R_DS(on) TYP
5.0 mW @ 10 V
7.5 mW @ 4.5 V
N−Channel
D
I_D MAX
90 A
MAXIMUM RATINGS (T_J = 25°C unless otherwise noted)
Rating
Symbol
Value
Unit
Drain−to−Source Voltage
Gate−to−Source Voltage
− Continuous
V_DSS
V_GS
24
Vdc
Vdc
"20
Drain Current
− Continuous @ T_A = 25°C
− Single Pulse (t_p = 10 ms)
I_D
90*
A
I_DM
200
A
Total Power Dissipation @ T_A = 25°C
P_D
85
W
Derate above 25°C
0.66
W/°C
Operating and Storage Temperature
Single Pulse Drain−to−Source Avalanche
Energy − Starting T_J = 25°C
(V_DD = 28 Vdc, V_GS = 10 Vdc,
L = 5.0 mH, I_L(pk) = 17 A, RG = 25 W)
Thermal Resistance
Junction−to−Case
Junction−to−Ambient (Note 1)
T_J, T_stg
E_AS
R_qJC
R_qJA
−55 to +150 °C
733
mJ
°C/W
1.55
70
Maximum Lead Temperature for Soldering
T_L
Purposes, 1/8″ from case for 10 seconds
260
°C
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. When surface mounted to an FR4 board using 1″ pad size, (Cu Area 1.127 in²).
2. When surface mounted to an FR4 board using minimum recommended pad
size, (Cu Area 0.412 in²).
*Chip current capability limited by package.
© Semiconductor Components Industries, LLC, 2005
1
March, 2005 − Rev. 2
G
S
MARKING
DIAGRAMS
4
4
Drain
1
2
3
TO−220AB
CASE 221A
STYLE 5
NTx90N02
AYWW
1
Gate
3
Source
2
Drain
4
Drain
12
3
4 _D2_PAK
CASE 418B
STYLE 2
NTx90N02
AYWW
NTx90N02
x
A
Y
WW
1
Gate
= Device Code
= P or B
= Assembly Location
= Year
= Work Week
2
Drain
3
Source
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 4 of this data sheet.
Publication Order Number:
NTB90N02/D