NTB75N03R Datasheet, PDF (1/8 Pages) ON Semiconductor – Power MOSFET 75 Amps, 25 Volts N-Channel D2PAK, TO-220

NTB75N03R, NTP75N03R
Power MOSFET
75 Amps, 25 Volts
N−Channel D²PAK, TO−220
Features
• Planar HD3e Process for Fast Switching Performance
• Low R_DS(on) to Minimize Conduction Loss
• Low C_iss to Minimize Driver Loss
• Low Gate Charge
MAXIMUM RATINGS (T_J = 25°C Unless otherwise specified)
Parameter
Symbol Value Unit
Drain−to−Source Voltage
Gate−to−Source Voltage − Continuous
Thermal Resistance − Junction−to−Case
Total Power Dissipation @ T_C = 25°C
Drain Current
− Continuous @ T_C = 25°C
− Single Pulse (t_p = 10 ms)
Thermal Resistance − Junction−to−Ambient
(Note 1)
Total Power Dissipation @ T_A = 25°C
Drain Current − Continuous @ T_A = 25°C
Thermal Resistance − Junction−to−Ambient
(Note 2)
Total Power Dissipation @ T_A = 25°C
Drain Current − Continuous @ T_A = 25°C
Operating and Storage Temperature Range
V_DSS
V_GS
R_qJC
P_D
I_D
I_DM
R_qJA
P_D
I_D
R_qJA
P_D
I_D
T_J, T_stg
25
±20
1.68
74.4
V_dc
V_dc
°C/W
W
75
A
225 A
60 °C/W
2.08 W
12.6 A
100 °C/W
1.25 W
9.7
A
−55 to °C
150
Single Pulse Drain−to−Source Avalanche
Energy − Starting T_J = 25°C
(V_DD = 30 V_dc, V_GS = 10 V_dc, I_L = 12 A_pk,
L = 1 mH, R_G = 25 W)
Maximum Lead Temperature for Soldering
Purposes, 1/8″ from Case for 10 Seconds
E_AS
71.7 mJ
T_L
260 °C
1. When surface mounted to an FR4 board using 1 inch pad size,
(Cu Area 1.127 in²).
2. When surface mounted to an FR4 board using minimum recommended pad
size, (Cu Area 0.412 in²).
http://onsemi.com
75 AMPERES
25 VOLTS
R_DS(on) = 5.6 mΩ (Typ)
4
4
12
3
1
2
3
TO−220AB
CASE 221A
STYLE 5
D²PAK
CASE 418AA
STYLE 2
MARKING DIAGRAMS
& PIN ASSIGNMENTS
4
Drain
4
Drain
P75N03R
YWW
1
Gate
3
Source
1
Gate
75N03R
YWW
2
3
Drain _Source
2
Drain
75N03
Y
WW
= Device Code
= Year
= Work Week
ORDERING INFORMATION
Device
Package
Shipping^†
NTP75N03R
NTB75N03R
NTB75N03RT4
TO−220AB
D²PAK
D²PAK
50 Units/Rail
50 Units/Rail
800/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2003
1
October, 2003 − Rev. 2
Publication Order Number:
NTB75N03R/D