NTB5605P_05 Datasheet, PDF (1/7 Pages) ON Semiconductor – Power MOSFET -60 Volt, -18.5 Amp

NTB5605P
Power MOSFET
−60 Volt, −18.5 Amp
P−Channel, D²PAK
Features
• Designed for Low R_DS(on)
• Withstands High Energy in Avalanche and Commutation Modes
• Pb−Free Packages are Available
Applications
• Power Supplies
• PWM Motor Control
• Converters
• Power Management
MAXIMUM RATINGS (T_J = 25°C unless otherwise noted)
Parameter
Symbol Value Unit
Drain−to−Source Voltage
V_DSS
−60
V
Gate−to−Source Voltage
V_GS
$20
V
Continuous Drain
Current (Note 1)
Steady T_A = 25°C
I_D
State
−18.5 A
Power Dissipation
(Note 1)
Steady T_A = 25°C
P_D
State
88
W
Pulsed Drain Current
t_p = 10 ms
I_DM
−55
A
Operating Junction and Storage Temperature
T_J,
−55 to °C
T_STG
175
Single Pulse Drain−to−Source Avalanche
E_AS
Energy (V_DD = 25 V, V_GS = 5.0 V, I_PK = 15 A,
L = 3.0 mH, R_G = 25 W)
338
mJ
Lead Temperature for Soldering Purposes
(1/8 in from case for 10 s)
T_L
260
°C
THERMAL RESISTANCE RATINGS
Parameter
Symbol Max Unit
Junction−to−Case (Drain) – Steady State
R_qJC
1.7 °C/W
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. When surface mounted to an FR4 board using 1″ pad size (Cu Area 1.127 in²).
2. When surface mounted to an FR4 board using the minimum recommended
pad size (Cu Area 0.41 in²).
http://onsemi.com
V_(BR)DSS
−60 V
R_DS(on) TYP
120 mW @ −5.0 V
I_D MAX
−18.5 A
P−Channel
D
G
S
MARKING DIAGRAM
& PIN ASSIGNMENT
4
12
3
D²PAK
CASE 418B
STYLE 2
4
Drain
NTB5605PG
AYWW
12 3
Gate Drain Source
NTB5605P
A
Y
WW
G
= Device Code
= Assembly Location
= Year
= Work Week
= Pb−Free Package
ORDERING INFORMATION
Device
Package
Shipping^†
NTB5605P
D²PAK
50 Units/Rail
NTB5605PG
NTB5605PT4
NTB5605PT4G
D²PAK
(Pb−Free)
D²PAK
D²PAK
(Pb−Free)
50 Units/Rail
800 Tape & Reel
800 Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2005
1
August, 2005 − Rev. 2
Publication Order Number:
NTB5605P/D